JAJSM96 may   2023 DRV8849

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Indexer Timing Requirements
    7. 7.7 Typical Operating Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Stepper Motor Driver Current Ratings
        1. 8.3.1.1 Peak Current Rating
        2. 8.3.1.2 RMS Current Rating
        3. 8.3.1.3 Full-Scale Current Rating
      2. 8.3.2 Microstepping Indexer
      3. 8.3.3 Controlling VREF with an MCU DAC
      4. 8.3.4 Current Regulation and Decay Modes
        1. 8.3.4.1 Smart tune Ripple Control
        2. 8.3.4.2 Smart tune Dynamic Decay
        3. 8.3.4.3 Blanking time
      5. 8.3.5 Charge Pump
      6. 8.3.6 Logic Level, tri-level and quad-level Pin Diagrams
      7. 8.3.7 nFAULT Pins
      8. 8.3.8 Protection Circuits
        1. 8.3.8.1 VM Undervoltage Lockout (UVLO)
        2. 8.3.8.2 VCP Undervoltage Lockout (CPUV)
        3. 8.3.8.3 Overcurrent Protection (OCP)
          1. 8.3.8.3.1 Latched Shutdown
          2. 8.3.8.3.2 Automatic Retry
        4. 8.3.8.4 Thermal Shutdown (OTSD)
          1. 8.3.8.4.1 Latched Shutdown
          2. 8.3.8.4.2 Automatic Retry
        5. 8.3.8.5 Fault Condition Summary
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode (nSLEEP = 0)
      2. 8.4.2 Disable Mode (nSLEEP = 1, ENABLE = 0)
      3. 8.4.3 Operating Mode (nSLEEP = 1, ENABLE = Hi-Z/1)
      4. 8.4.4 nSLEEP Reset Pulse
      5. 8.4.5 Functional Modes Summary
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Stepper Motor Speed
        2. 9.2.2.2 Current Regulation
        3. 9.2.2.3 Decay Modes
        4. 9.2.2.4 Application Curves
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Bulk Capacitance
  12. 11デバイスおよびドキュメントのサポート
    1. 11.1 関連資料
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)±2000V
Charged-device model (CDM), per ANSI/ESDA/JEDEC JS-002 (1)±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.