SLVSHN2 July 2024 DRV8962-Q1
PRODUCTION DATA
THERMAL METRIC | DDW | UNIT | |
---|---|---|---|
RθJA | Junction-to-ambient thermal resistance | 22.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 9.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 5.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 5.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.7 | °C/W |