SLVSHN2 July   2024 DRV8962-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Feature Description
    4. 6.4  Independent Half-bridge Operation
    5. 6.5  Current Sensing and Regulation
      1. 6.5.1 Current Sensing and Feedback
      2. 6.5.2 Current Sensing with External Resistor
      3. 6.5.3 Current Regulation
    6. 6.6  Charge Pump
    7. 6.7  Linear Voltage Regulator
    8. 6.8  VCC Voltage Supply
    9. 6.9  Logic Level Pin Diagram
    10. 6.10 Protection Circuits
      1. 6.10.1 VM Undervoltage Lockout (UVLO)
      2. 6.10.2 VCP Undervoltage Lockout (CPUV)
      3. 6.10.3 Logic Supply Power on Reset (POR)
      4. 6.10.4 Overcurrent Protection (OCP)
      5. 6.10.5 Thermal Shutdown (OTSD)
      6. 6.10.6 nFAULT Output
      7. 6.10.7 Fault Condition Summary
    11. 6.11 Device Functional Modes
      1. 6.11.1 Sleep Mode
      2. 6.11.2 Operating Mode
      3. 6.11.3 nSLEEP Reset Pulse
      4. 6.11.4 Functional Modes Summary
  8. 7Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving Solenoid Loads
        1. 7.1.1.1 Solenoid Driver Typical Application
        2. 7.1.1.2 Thermal Calculations
          1. 7.1.1.2.1 Power Loss Calculations
          2. 7.1.1.2.2 Junction Temperature Estimation
        3. 7.1.1.3 Application Performance Plots
      2. 7.1.2 Driving Stepper Motors
        1. 7.1.2.1 Stepper Driver Typical Application
        2. 7.1.2.2 Power Loss Calculations
        3. 7.1.2.3 Junction Temperature Estimation
      3. 7.1.3 Driving Brushed-DC Motors
        1. 7.1.3.1 Brushed-DC Driver Typical Application
        2. 7.1.3.2 Power Loss Calculation
        3. 7.1.3.3 Junction Temperature Estimation
        4. 7.1.3.4 Driving Single Brushed-DC Motor
      4. 7.1.4 Driving Thermoelectric Coolers (TEC)
      5. 7.1.5 Driving Brushless DC Motors
    2. 7.2 Package Thermal Considerations
      1. 7.2.1 Thermal Performance
        1. 7.2.1.1 Steady-State Thermal Performance
        2. 7.2.1.2 Transient Thermal Performance
      2. 7.2.2 PCB Material Recommendation
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
      2. 7.3.2 Power Supplies
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4.1 Layout Guidelines

  • The VM pins should be bypassed to PGND pins using low-ESR ceramic bypass capacitors with a recommended value of 0.01 µF rated for VM. The capacitors should be placed as close to the VM pins as possible with a thick trace or ground plane connection to the device PGND pins.

  • The VM pins should be bypassed to PGND using a bulk capacitor rated for VM. This component can be an electrolytic capacitor.

  • A low-ESR ceramic capacitor must be placed in between the CPL and CPH pins. A value of 0.1 µF rated for VM is recommended. Place this component as close to the pins as possible.

  • A low-ESR ceramic capacitor must be placed in between the VM and VCP pins. A value of 1 µF rated for 16 V is recommended. Place this component as close to the pins as possible.

  • Bypass the DVDD pin to ground with a low-ESR ceramic capacitor. A value of 1 µF rated for 6.3 V is recommended. Place this bypassing capacitor as close to the pin as possible.

  • Bypass the VCC pin to ground with a low-ESR ceramic capacitor. A value of 0.1 µF rated for 6.3 V is recommended. Place this bypassing capacitor as close to the pin as possible.

  • In general, inductance between the power supply pins and decoupling capacitors must be avoided.

  • The thermal PAD of the package must be connected to system ground.

    • It is recommended to use a big unbroken single ground plane for the whole system / board. The ground plane can be made at bottom PCB layer.

    • In order to minimize the impedance and inductance, the traces from ground pins should be as short and wide as possible, before connecting to bottom layer ground plane through vias.

    • Multiple vias are suggested to reduce the impedance.

    • Try to clear the space around the device as much as possible especially at bottom PCB layer to improve the heat spreading.

    • Single or multiple internal ground planes connected to the thermal PAD will also help spreading the heat and reduce the thermal resistance.