SLVSHN2 July   2024 DRV8962-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Feature Description
    4. 6.4  Independent Half-bridge Operation
    5. 6.5  Current Sensing and Regulation
      1. 6.5.1 Current Sensing and Feedback
      2. 6.5.2 Current Sensing with External Resistor
      3. 6.5.3 Current Regulation
    6. 6.6  Charge Pump
    7. 6.7  Linear Voltage Regulator
    8. 6.8  VCC Voltage Supply
    9. 6.9  Logic Level Pin Diagram
    10. 6.10 Protection Circuits
      1. 6.10.1 VM Undervoltage Lockout (UVLO)
      2. 6.10.2 VCP Undervoltage Lockout (CPUV)
      3. 6.10.3 Logic Supply Power on Reset (POR)
      4. 6.10.4 Overcurrent Protection (OCP)
      5. 6.10.5 Thermal Shutdown (OTSD)
      6. 6.10.6 nFAULT Output
      7. 6.10.7 Fault Condition Summary
    11. 6.11 Device Functional Modes
      1. 6.11.1 Sleep Mode
      2. 6.11.2 Operating Mode
      3. 6.11.3 nSLEEP Reset Pulse
      4. 6.11.4 Functional Modes Summary
  8. 7Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Driving Solenoid Loads
        1. 7.1.1.1 Solenoid Driver Typical Application
        2. 7.1.1.2 Thermal Calculations
          1. 7.1.1.2.1 Power Loss Calculations
          2. 7.1.1.2.2 Junction Temperature Estimation
        3. 7.1.1.3 Application Performance Plots
      2. 7.1.2 Driving Stepper Motors
        1. 7.1.2.1 Stepper Driver Typical Application
        2. 7.1.2.2 Power Loss Calculations
        3. 7.1.2.3 Junction Temperature Estimation
      3. 7.1.3 Driving Brushed-DC Motors
        1. 7.1.3.1 Brushed-DC Driver Typical Application
        2. 7.1.3.2 Power Loss Calculation
        3. 7.1.3.3 Junction Temperature Estimation
        4. 7.1.3.4 Driving Single Brushed-DC Motor
      4. 7.1.4 Driving Thermoelectric Coolers (TEC)
      5. 7.1.5 Driving Brushless DC Motors
    2. 7.2 Package Thermal Considerations
      1. 7.2.1 Thermal Performance
        1. 7.2.1.1 Steady-State Thermal Performance
        2. 7.2.1.2 Transient Thermal Performance
      2. 7.2.2 PCB Material Recommendation
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
      2. 7.3.2 Power Supplies
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.1.1.2 Thermal Calculations

The output current and power dissipation capabilities of the device are heavily dependent on the PCB design and external system conditions. This section provides some guidelines for calculating these values.

Total power dissipation for the device is composed of three main components. These are the power MOSFET RDS(ON) (conduction) losses, the power MOSFET switching losses and the quiescent supply current dissipation. While other factors may contribute additional power losses, these other items are typically insignificant compared to the three main items.