SNLS482B April   2014  – January 2017 DS125DF1610

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Additional Thermal Information
    6. 6.6 Electrical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Data Path Operation
      2. 7.3.2  AC-Coupled Receiver with Signal Detect
      3. 7.3.3  CTLE
      4. 7.3.4  Cross Point Switch
      5. 7.3.5  DFE with VGA
      6. 7.3.6  Clock and Data Recovery
      7. 7.3.7  Reference Clock
      8. 7.3.8  Differential Driver with FIR Filter
      9. 7.3.9  Setting the Output VOD
      10. 7.3.10 Output Driver Polarity Inversion
      11. 7.3.11 Driver Output Rise/Fall Time
      12. 7.3.12 Debug Features
        1. 7.3.12.1 Pattern Generator
        2. 7.3.12.2 Pattern Checker
        3. 7.3.12.3 Eye Opening Monitor
      13. 7.3.13 Interrupt Signals
      14. 7.3.14 Other Features
        1. 7.3.14.1 Lock Sequencer
        2. 7.3.14.2 RESET_IO Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 SMBus Master Mode
      2. 7.4.2 SMBus Slave Mode
        1. 7.4.2.1 SDA and SDC
        2. 7.4.2.2 SMBus Address Configuration
      3. 7.4.3 Device Configuration in SMBus Slave Mode
    5. 7.5 Programming
      1. 7.5.1 Bit Fields in the Register Set
      2. 7.5.2 Writing to and Reading from the Global/Shared/Channel Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Typical Application Performance Plots
    3. 8.3 Initialization Setup
      1. 8.3.1 Data Rate Selection (Rate/Sub-Rate Table)
      2. 8.3.2 Data Rate Selection (Manual Programming)
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Filtering
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.