JAJSPA6 August   2020 DS90LV028A-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD and Latch-Up Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Performance Curves
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Decoupling Recommendations
        2. 9.2.2.2 Termination
        3. 9.2.2.3 Input Failsafe Biasing
        4. 9.2.2.4 Probing LVDS Transmission Lines
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Differential Traces
      2. 11.1.2 PC Board Considerations
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Support Resources
    2. 12.2 Trademarks
    3. 12.3 静電気放電に関する注意事項
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)DS90LV028A-Q1UNIT
DQF (WSON)
8 PINS
RθJAJunction-to-ambient thermal resistance104.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance33.3°C/W
RθJBJunction-to-board thermal resistance27.6°C/W
ψJTJunction-to-top characterization parameter0.3°C/W
ψJBJunction-to-board characterization parameter27.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.