JAJSH10B November   2014  – August 2019 DS90UH949-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  DC Electrical Characteristics
    6. 7.6  AC Electrical Characteristics
    7. 7.7  DC And AC Serial Control Bus Characteristics
    8. 7.8  Recommended Timing for the Serial Control Bus
    9. 7.9  Timing Diagrams
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  High-Definition Multimedia Interface (HDMI)
        1. 8.3.1.1 HDMI Receive Controller
      2. 8.3.2  Transition Minimized Differential Signaling
      3. 8.3.3  Enhanced Display Data Channel
      4. 8.3.4  Extended Display Identification Data (EDID)
        1. 8.3.4.1 External Local EDID (EEPROM)
        2. 8.3.4.2 Internal EDID (SRAM)
        3. 8.3.4.3 External Remote EDID
        4. 8.3.4.4 Internal Pre-Programmed EDID
      5. 8.3.5  Consumer Electronics Control (CEC)
      6. 8.3.6  +5-V Power Signal
      7. 8.3.7  Hot Plug Detect (HPD)
      8. 8.3.8  High-Speed Forward Channel Data Transfer
      9. 8.3.9  Back Channel Data Transfer
      10. 8.3.10 FPD-Link III Port Register Access
      11. 8.3.11 Power Down (PDB)
      12. 8.3.12 Serial Link Fault Detect
      13. 8.3.13 Interrupt Pin (INTB)
      14. 8.3.14 Remote Interrupt Pin (REM_INTB)
      15. 8.3.15 General-Purpose I/O
        1. 8.3.15.1 GPIO[3:0] and D_GPIO[3:0] Configuration
        2. 8.3.15.2 Back Channel Configuration
        3. 8.3.15.3 GPIO_REG[8:5] Configuration
      16. 8.3.16 SPI Communication
        1. 8.3.16.1 SPI Mode Configuration
        2. 8.3.16.2 Forward Channel SPI Operation
        3. 8.3.16.3 Reverse Channel SPI Operation
      17. 8.3.17 Backward Compatibility
      18. 8.3.18 Audio Modes
        1. 8.3.18.1 HDMI Audio
        2. 8.3.18.2 DVI I2S Audio Interface
          1. 8.3.18.2.1 I2S Transport Modes
          2. 8.3.18.2.2 I2S Repeater
        3. 8.3.18.3 AUX Audio Channel
        4. 8.3.18.4 TDM Audio Interface
      19. 8.3.19 HDCP
        1. 8.3.19.1 HDCP I2S Audio Encryption
      20. 8.3.20 Built-In Self Test (BIST)
        1. 8.3.20.1 BIST Configuration And Status
        2. 8.3.20.2 Forward Channel and Back Channel Error Checking
      21. 8.3.21 Internal Pattern Generation
        1. 8.3.21.1 Pattern Options
        2. 8.3.21.2 Color Modes
        3. 8.3.21.3 Video Timing Modes
        4. 8.3.21.4 External Timing
        5. 8.3.21.5 Pattern Inversion
        6. 8.3.21.6 Auto Scrolling
        7. 8.3.21.7 Additional Features
      22. 8.3.22 Spread Spectrum Clock Tolerance
    4. 8.4 Device Functional Modes
      1. 8.4.1 Mode Select Configuration Settings (MODE_SEL[1:0])
      2. 8.4.2 FPD-Link III Modes of Operation
        1. 8.4.2.1 Single Link Operation
        2. 8.4.2.2 Dual Link Operation
        3. 8.4.2.3 Replicate Mode
        4. 8.4.2.4 Auto-Detection of FPD-Link III Modes
      3. 8.4.3 Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
    5. 8.5 Programming
      1. 8.5.1 Serial Control Bus
      2. 8.5.2 Multi-Master Arbitration Support
      3. 8.5.3 I2C Restrictions on Multi-Master Operation
      4. 8.5.4 Multi-Master Access to Device Registers for Newer FPD-Link III Devices
      5. 8.5.5 Multi-Master Access to Device Registers for Older FPD-Link III Devices
      6. 8.5.6 Restrictions on Control Channel Direction for Multi-Master Operation
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Applications Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 High-Speed Interconnect Guidelines
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Application Performance Plots
  10. 10Power Supply Recommendations
    1. 10.1 Power-Up Requirements and PDB Pin
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.1 Overview

The DS90UH949-Q1 converts an HDMI interface (3 TMDS data channels + 1 TMDS Clock) to an FPD-Link III interface. This device transmits a 35-bit symbol over a single serial pair operating up to 3.36-Gbps line rate, or two serial pairs operating up to 2.975-Gbps line rate. The serial stream contains an embedded clock, video control signals, RGB video data, and audio data. The payload is DC-balanced to enhance signal quality and support AC coupling.

The DS90UH949-Q1 serializer is intended for use with a DS90UH926Q-Q1, DS90UH928Q-Q1, DS90UH940-Q1, DS90UH948-Q1 deserializer.

The DS90UH949-Q1 serializer and companion deserializer incorporate an I2C-compatible interface. The I2C-compatible interface allows programming of serializer or deserializer devices from a local host controller. In addition, the device incorporates a bidirectional control channel (BCC) that allows communication between serializer and deserializer, as well as remote I2C slave devices.

The bidirectional control channel (BCC) is implemented through embedded signaling in the high-speed forward channel (serializer to deserializer) combined with lower speed signaling in the reverse channel (deserializer to serializer). Through this interface, the BCC provides a mechanism to bridge I2C transactions across the serial link from one I2C bus to another. The implementation allows for arbitration with other I2C-compatible masters at either side of the serial link.