SNLS231P September   2006  – August 2024 DS90UR124-Q1 , DS90UR241-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Serializer Input Timing Requirements for TCLK
    7. 5.7 Serializer Switching Characteristics
    8. 5.8 Deserializer Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Initialization and Locking Mechanism
      2. 6.3.2  Data Transfer
      3. 6.3.3  Resynchronization
      4. 6.3.4  Powerdown
      5. 6.3.5  Tri-State
      6. 6.3.6  Pre-Emphasis
      7. 6.3.7  AC-Coupling and Termination
        1. 6.3.7.1 Receiver Termination Option 1
        2. 6.3.7.2 Receiver Termination Option 2
        3. 6.3.7.3 Receiver Termination Option 3
      8. 6.3.8  Signal Quality Enhancers
      9. 6.3.9  @SPEED-BIST Test Feature
      10. 6.3.10 Backward-Compatible Mode With DS90C241 and DS90C124
    4. 6.4 Device Functional Modes
  8.   Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Using the DS90UR241 and DS90UR124
      2. 7.1.2 Display Application
      3. 7.1.3 Typical Application Connection
    2. 7.2 Typical Applications
      1. 7.2.1 DS90UR241-Q1 Typical Application Connection
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Power Considerations
          2. 7.2.1.2.2 Noise Margin
          3. 7.2.1.2.3 Transmission Media
          4. 7.2.1.2.4 46
          5. 7.2.1.2.5 Live Link Insertion
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DS90UR124 Typical Application Connection
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 PCB Layout and Power System Considerations
        2. 7.4.1.2 LVDS Interconnect Guidelines
      2. 7.4.2 Layout Examples
  9. 7Device and Documentation Support
    1. 7.1 Device Support
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation
    3. 7.3 Receiving Notification of Documentation Updates
    4. 7.4 Support Resources
    5. 7.5 Trademarks
    6. 7.6 Electrostatic Discharge Caution
    7. 7.7 Glossary
  10. 8Revision History
  11.   Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

5.2 ESD Ratings

VALUEUNIT
DS90UR241-Q1 IN PFB PACKAGE
V(ESD)Electrostatic dischargeHuman body model (HBM), per AEC Q100-002(1)All pins≥±8000V
Charged device model (CDM), per AEC Q100-011Corner pins (1, 12, 13, 24, 25, 36, 37, and 48)±1000
Other pins±1000
(ISO10605)(2)Contact Discharge (20, 19)±10000
Air Discharge (20, 19)±30000
DS90UR124-Q1 IN PAG PACKAGE
V(ESD)Electrostatic dischargeHuman body model (HBM), per AEC Q100-002(1)All pins≥±8000V
Charged device model (CDM), per AEC Q100-011Corner pins (1, 16, 17, 32, 33, 48, 49, and 64)±1000
Other pins±1000
(ISO10605)(2)Contact Discharge (RIN+, RIN−)±10000
Air Discharge (RIN+, RIN−)±30000
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) RD = 2kΩ, CS = 330pF