JAJSI09I September   2009  – October  2019 DS90UR905Q-Q1 , DS90UR906Q-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション図
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     DS90UR905Q-Q1 Serializer Pin Functions
    2.     DS90UR906Q-Q1 Deserializer Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Serializer DC Electrical Characteristics
    6. 7.6  Deserializer DC Electrical Characteristics
    7. 7.7  DC and AC Serial Control Bus Characteristics
    8. 7.8  Timing Requirements for DC and AC Serial Control Bus
    9. 7.9  Timing Requirements for Serializer PCLK
    10. 7.10 Timing Requirements for Serial Control Bus
    11. 7.11 Switching Characteristics: Serializer
    12. 7.12 Switching Characteristics: Deserializer
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Data Transfer
      2. 8.3.2 Video Control Signal Filter — Serializer and Deserializer
      3. 8.3.3 Serializer Functional Description
        1. 8.3.3.1 EMI Reduction Features
          1. 8.3.3.1.1 Serializer Spread Spectrum Compatibility
        2. 8.3.3.2 Signal Quality Enhancers
          1. 8.3.3.2.1 Serializer VOD Select (VODSEL)
          2. 8.3.3.2.2 Serializer De-Emphasis (De-Emph)
        3. 8.3.3.3 Power-Saving Features
          1. 8.3.3.3.1 Serializer Power-down Feature (PDB)
          2. 8.3.3.3.2 Serializer Stop Clock Feature
          3. 8.3.3.3.3 1.8-V or 3.3-V VDDIO Operation
        4. 8.3.3.4 Serializer Pixel Clock Edge Select (RFB)
        5. 8.3.3.5 Optional Serial Bus Control
        6. 8.3.3.6 Optional BIST Mode
      4. 8.3.4 Deserializer Functional Description
        1. 8.3.4.1  Signal Quality Enhancers
          1. 8.3.4.1.1 Deserializer Input Equalizer Gain (EQ)
        2. 8.3.4.2  EMI Reduction Features
          1. 8.3.4.2.1 Deserializer Output Slew (OS_PCLK/DATA)
          2. 8.3.4.2.2 Deserializer Common-Mode Filter Pin (CMF) — Optional
          3. 8.3.4.2.3 Deserializer SSCG Generation — Optional
          4. 8.3.4.2.4 1.8-V or 3.3-V VDDIO Operation
        3. 8.3.4.3  Power-Saving Features
          1. 8.3.4.3.1 Deserializer Power-Down Feature (PDB)
          2. 8.3.4.3.2 Deserializer Stop Stream SLEEP Feature
        4. 8.3.4.4  Deserializer CLOCK-DATA RECOVERY STATUS FLAG (LOCK) and OUTPUT STATE SELECT (OSS_SEL)
        5. 8.3.4.5  Deserializer Oscillator Output (Optional)
        6. 8.3.4.6  Deserializer OP_LOW (Optional)
        7. 8.3.4.7  Deserializer Pixel Clock Edge Select (RFB)
        8. 8.3.4.8  Deserializer Control Signal Filter (Optional)
        9. 8.3.4.9  Deserializer Low Frequency Optimization (LF_Mode)
        10. 8.3.4.10 Deserializer Map Select
        11. 8.3.4.11 Deserializer Strap Input Pins
        12. 8.3.4.12 Optional Serial Bus Control
        13. 8.3.4.13 Optional BIST Mode
      5. 8.3.5 Built-In Self Test (BIST)
        1. 8.3.5.1 Sample BIST Sequence
        2. 8.3.5.2 BER Calculations
      6. 8.3.6 Optional Serial Bus Control
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serializer and Deserializer Operating Modes and Backward Compatibility (CONFIG[1:0])
    5. 8.5 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Display Application
      2. 9.1.2 Live Link Insertion
      3. 9.1.3 Alternate Color / Data Mapping
    2. 9.2 Typical Applications
      1. 9.2.1 DS90UR905Q-Q1 Typical Connection
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 DS90UR906Q-Q1 Typical Connection
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Up Requirements and PDB Pin
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Transmission Media
      2. 11.1.2 LVDS Interconnect Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 関連リンク
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(2)(1)(3).
MIN MAX UNIT
Supply voltage – VDDn (1.8 V) –0.3 2.5 V
Supply voltage – VDDIO –0.3 4 V
LVCMOS I/O voltage –0.3 VDDIO + 0.3 V
Receiver input voltage –0.3 VDD + 0.3 V
Driver output voltage –0.3 VDD + 0.3 V
Junction temperature 150 °C
48L RHS package Maximum power dissipation capacity at 25°C 215 mW
Derate above 25°C 1/θJA mW/°C
60L NKB package Maximum power dissipation capacity at 25°C 470 mW
Derate above 25°C 1/θJA mW/°C
Storage temperature –65 150 °C
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office or Distributors for availability and specifications.
(2) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(3) For soldering specifications see product folder at www.ti.com and SNOA549.