JAJSEP1A February   2018  – March 2018 ESD224

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     代表的なアプリケーションの回路図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings -JEDEC Specifications
    3. 6.3 ESD Ratings - IEC Specifications
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Setup
    1. 7.1 IEC 61000-4-2 System Level ESD Test Setup with HDMI Driver for Clamping Voltage Measurement
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 IEC 61000-4-2 ESD Protection
      2. 8.3.2 IEC 61000-4-4 EFT Protection
      3. 8.3.3 IEC 61000-4-5 Surge Protection
      4. 8.3.4 IO Capacitance
      5. 8.3.5 DC Breakdown Voltage
      6. 8.3.6 Ultra Low Leakage Current
      7. 8.3.7 Low ESD Clamping Voltage
      8. 8.3.8 Supports High Speed Interfaces
      9. 8.3.9 Industrial Temperature Range
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Signal Range
        2. 9.2.2.2 Operating Frequency
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9.1 Application Information

The ESD224 is a diode type TVS which is used to provide a path to ground for dissipating ESD events on high-speed signal lines between a human interface connector and a system. As the current from ESD passes through the TVS, only a small voltage drop is present across the diode. Part of this voltage drop across the diode drops across the series element between the connector side pin and the system-side pin. Therefore, the effective voltage drop across the protected IC is smaller than the voltage drop across the diode. It is recommended to avoid through-routing for this ESD diode (single trace connecting both the connector side pin and the system side pin) for the best ESD performance.