JAJSFQ4C May 2018 – February 2024 ESDS311 , ESDS312 , ESDS314
PRODUCTION DATA
- 1
- 1 特長
- 2 アプリケーション
- 3 概要
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
パッケージ・オプション
デバイスごとのパッケージ図は、PDF版データシートをご参照ください。
メカニカル・データ（パッケージ｜ピン）
- DYF|2
サーマルパッド・メカニカル・データ
発注情報
5.7 Typical Characteristics
Figure 5-1 Clamping Voltage vs. Peak Pulse Current (tp= 8/20µs), Any IO Pin to GND
Figure 5-3 Surge Current, Clamping Voltage and Power Curve (tp = 8/20µs), Any IO Pin to GND
Figure 5-5 TLP I-V Curve, IO to GND, tp = 100ns
Figure 5-7 +8kV IEC 61000-4-2 Clamping Voltage Waveform
Figure 5-9 DC Leakage vs. Ambient Temperature, Bias Voltage = 3.6V
Figure 5-11 Surge Power Derating with Respect To Ambient Temperature
Figure 5-2 Clamping Voltage vs. Peak Pulse Current (tp= 8/20µs), GND to Any IO Pin
Figure 5-4 DC I-V Curve
Figure 5-6 TLP I-V Curve, IO to GND Negative, tp=100ns
Figure 5-8 -8kV IEC 61000-4-2 Clamping Voltage Waveform
Figure 5-10 Capacitance vs. Bias Voltage at 25 °C
Figure 5-12 Differential Insertion Loss