JAJSLL4C December   2016  – January 2021 HD3SS213

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 HD3SS213 AUX Channel in 2:1 Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 HD3SS213 AUX Channel in 1:2 Application
        1.       Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Differential Traces
    2. 9.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.2.1.2 Detailed Design Procedure

  • Connect VDD and GND pins to the power and ground planes of the printed-circuit board with 0.1-µF bypass capacitor
  • Use VDD/2 logic level at AUX_SEL pin
  • Use 3.3-V TTL/CMOS logic level at Dx_SEL to connect DAx to DCx
  • Use GND logic level at Dx_SEL to connect DBx to DCx
  • Use controlled-impedance transmission media for all the differential signals
  • Ensure the received complimentary signals are with a differential amplitude of <1800 mVPP and a common-mode voltage of <2 V