JAJSJQ2C june   2021  – march 2023 HDC3020-Q1 , HDC3021-Q1 , HDC3022-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Factory Installed Polyimide Tape
      2. 8.3.2  Factory Installed IP67 Protection Cover
      3. 8.3.3  Wettable Flanks
      4. 8.3.4  Measurement of Relative Humidity and Temperature
      5. 8.3.5  Offset Error Correction: Accuracy Restoration
      6. 8.3.6  NIST Traceability of Relative Humidity and Temperature Sensor
      7. 8.3.7  Measurement Modes: Trigger-On Demand vs Auto Measurement
      8. 8.3.8  Heater
      9. 8.3.9  ALERT Output With Programmable Interrupts
      10. 8.3.10 Checksum Calculation
      11. 8.3.11 Programmable Offset of Relative Humidity and Temperature Results
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 I2C Serial Bus Address Configuration
      3. 8.5.3 I2C Write - Send Device Command
      4. 8.5.4 I2C Read - Retrieve Single Data Result
      5. 8.5.5 I2C Read - Retrieve Multi Data Result
      6. 8.5.6 I2C Repeated START - Send Command and Retrieve Data Results
      7. 8.5.7 Command Table and Detailed Description
        1. 8.5.7.1 Reset
          1. 8.5.7.1.1 Soft Reset
          2. 8.5.7.1.2 I2C General Call Reset
        2. 8.5.7.2 Trigger-On Demand
        3. 8.5.7.3 Auto Measurement Mode
          1. 8.5.7.3.1 Auto Measurement Mode: Enable and Configure Measurement Interval
          2. 8.5.7.3.2 Auto Measurement Mode: Measurement Readout
          3. 8.5.7.3.3 Auto Measurement Mode: Exit
          4. 8.5.7.3.4 Auto Measurement Mode: Measurement History Readout
          5. 8.5.7.3.5 Override Default Device Power-On and Device-Reset State
        4. 8.5.7.4 ALERT Output Configuration
          1. 8.5.7.4.1 ALERT Output: Environmental Tracking of Temperature and Relative Humidity
          2. 8.5.7.4.2 ALERT Output: Representation of Environmental Thresholds and Default Threshold Values
          3. 8.5.7.4.3 ALERT Output: Steps to Calculate and Program Environmental Thresholds
          4. 8.5.7.4.4 ALERT Output: Deactivation of Environmental Tracking
          5. 8.5.7.4.5 ALERT Output: Transfer Thresholds into Non-Volatile Memory
        5. 8.5.7.5 Programmable Measurement Offset
          1. 8.5.7.5.1 Representation of Offset Value and Factory Shipped Default Value
          2. 8.5.7.5.2 Factory Shipped Default Offset Values
          3. 8.5.7.5.3 Calculate Relative Humidity Offset Value
          4. 8.5.7.5.4 Calculate Temperature Offset Value
          5. 8.5.7.5.5 Write an Offset Value
          6. 8.5.7.5.6 Verify a Programmed Offset Value
        6. 8.5.7.6 Status Register
        7. 8.5.7.7 Heater: Enable and Disable
        8. 8.5.7.8 Heater: Configure Level of Heater Current
        9. 8.5.7.9 Read NIST ID/Serial Number
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Storage and PCB Assembly
        1. 9.4.3.1 Storage and Handling
        2. 9.4.3.2 Soldering Reflow
        3. 9.4.3.3 Rework
        4. 9.4.3.4 Exposure to High Temperature and High Humidity Conditions
        5. 9.4.3.5 Bake/Rehydration Procedure
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DEF|8
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision B (August 2022) to Revision C (March 2023)

  • データシートのステータスを「量産混合」から「量産データ」に変更Go
  • HDC3022-Q1 デバイスからプレビューの注を削除Go

Changes from Revision A (September 2021) to Revision B (August 2022)

  • RTM の特性データに基づいてタイトルを変更Go
  • データシートのステータスを「事前情報」から「量産混合」に変更Go
  • HDC3020QDEFRQ1 および HDC3021QDEHRQ1 の注文可能ステータスを「事前情報」から「量産データ」に変更Go
  • 機能安全対応を特長リストに追加し、追加の資料にリンク。Go
  • 製品プレビューとしてウェッタブル・フランクのパッケージ・オプションを追加。Go
  • ドリフト補正をオフセット誤差補正という名前に変更Go
  • CRC 機能を、コマンド / データではなくデータ専用に修正Go
  • HDC3021-Q1 および HDC3022-Q1 のデバイス・ステータスを「事前情報」から「量産データ」に更新。Go
  • PCB 洗浄に x22 保護を追加。車載部品のウェッタブル・フランク・オプションを追加(以前に追加済み)Go
  • Added HDC312x analog output to device comparison table and updated for HDC302x RTM dataGo
  • Change current table to family compare and added device compare to show wettable flank for auto and the protective cover optionsGo
  • Removed that ADDR and ADDR1 pins may be left floating. They should NOT be left floating.Go
  • Updated electrical specifications to reflect pre-production testing characterization.Go
  • Added typical graphs for RTM DSGo
  • Added x22 protects from PCB washGo
  • Added wettable flanks feature description sectionGo
  • Renamed drift correction to offset error correct and added information about it.Go
  • Added heater commandsGo
  • Corrected command code to read Manufacturing ID hex code LSB from: 80 to: 81Go
  • Added additional trigger on demand command codes: 0x2C06, 0x2C0D, 0x2C10Go
  • Moved the Power Supply Recommendations and Layout sections to the Application and Implementation sectionGo
  • Changed rehydration recommendation to 25°C and 50%RH for 5 daysGo