JAJSJQ2C june   2021  – march 2023 HDC3020-Q1 , HDC3021-Q1 , HDC3022-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing
    7. 7.7 Timing Diagram
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Factory Installed Polyimide Tape
      2. 8.3.2  Factory Installed IP67 Protection Cover
      3. 8.3.3  Wettable Flanks
      4. 8.3.4  Measurement of Relative Humidity and Temperature
      5. 8.3.5  Offset Error Correction: Accuracy Restoration
      6. 8.3.6  NIST Traceability of Relative Humidity and Temperature Sensor
      7. 8.3.7  Measurement Modes: Trigger-On Demand vs Auto Measurement
      8. 8.3.8  Heater
      9. 8.3.9  ALERT Output With Programmable Interrupts
      10. 8.3.10 Checksum Calculation
      11. 8.3.11 Programmable Offset of Relative Humidity and Temperature Results
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode vs Measurement Mode
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
      2. 8.5.2 I2C Serial Bus Address Configuration
      3. 8.5.3 I2C Write - Send Device Command
      4. 8.5.4 I2C Read - Retrieve Single Data Result
      5. 8.5.5 I2C Read - Retrieve Multi Data Result
      6. 8.5.6 I2C Repeated START - Send Command and Retrieve Data Results
      7. 8.5.7 Command Table and Detailed Description
        1. 8.5.7.1 Reset
          1. 8.5.7.1.1 Soft Reset
          2. 8.5.7.1.2 I2C General Call Reset
        2. 8.5.7.2 Trigger-On Demand
        3. 8.5.7.3 Auto Measurement Mode
          1. 8.5.7.3.1 Auto Measurement Mode: Enable and Configure Measurement Interval
          2. 8.5.7.3.2 Auto Measurement Mode: Measurement Readout
          3. 8.5.7.3.3 Auto Measurement Mode: Exit
          4. 8.5.7.3.4 Auto Measurement Mode: Measurement History Readout
          5. 8.5.7.3.5 Override Default Device Power-On and Device-Reset State
        4. 8.5.7.4 ALERT Output Configuration
          1. 8.5.7.4.1 ALERT Output: Environmental Tracking of Temperature and Relative Humidity
          2. 8.5.7.4.2 ALERT Output: Representation of Environmental Thresholds and Default Threshold Values
          3. 8.5.7.4.3 ALERT Output: Steps to Calculate and Program Environmental Thresholds
          4. 8.5.7.4.4 ALERT Output: Deactivation of Environmental Tracking
          5. 8.5.7.4.5 ALERT Output: Transfer Thresholds into Non-Volatile Memory
        5. 8.5.7.5 Programmable Measurement Offset
          1. 8.5.7.5.1 Representation of Offset Value and Factory Shipped Default Value
          2. 8.5.7.5.2 Factory Shipped Default Offset Values
          3. 8.5.7.5.3 Calculate Relative Humidity Offset Value
          4. 8.5.7.5.4 Calculate Temperature Offset Value
          5. 8.5.7.5.5 Write an Offset Value
          6. 8.5.7.5.6 Verify a Programmed Offset Value
        6. 8.5.7.6 Status Register
        7. 8.5.7.7 Heater: Enable and Disable
        8. 8.5.7.8 Heater: Configure Level of Heater Current
        9. 8.5.7.9 Read NIST ID/Serial Number
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Storage and PCB Assembly
        1. 9.4.3.1 Storage and Handling
        2. 9.4.3.2 Soldering Reflow
        3. 9.4.3.3 Rework
        4. 9.4.3.4 Exposure to High Temperature and High Humidity Conditions
        5. 9.4.3.5 Bake/Rehydration Procedure
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DEF|8
サーマルパッド・メカニカル・データ
発注情報

9.2.1 Design Requirements

To improve measurement accuracy, TI recommends to isolate the HDC302x-Q1 from all heat sources in the form of active circuitry, batteries, displays and resistive elements. If design space is a constraint, cutouts surrounding the device or the inclusion of small trenches can help minimize heat transfer from PCB heat sources to the HDC302x-Q1. To avoid self-heating the HDC302x-Q1, TI recommends to configure the device to no faster than 1 measurement/second.

The HDC302x-Q1 operates only as a target device and communicates with the host through the I2C-compatible serial interface. SCL is an input pin, SDA is a bidirectional pin, and ALERT is an output. The HDC302x-Q1 requires a pullup resistor on the SDA. An SCL pullup resistor is required if the system microprocessor SCL pin is open-drain. The recommended value for the pullup resistors is generally 5 kΩ. In some applications, the pullup resistor can be lower or higher than 5 kΩ. The size of the pullup resistor is determined by the amount of capacitance on the I2C lines and the communication frequency. For further details, see the I2C Pullup Resistor Calculation application note. A 0.1-µF bypass capacitor is recommended to be connected between V+ and GND. Use a ceramic capacitor type with a temperature rating that matches the operating range of the application, and place the capacitor as close as possible to the VDD pin of the HDC302x-Q1. The ADDR and ADDR0 pins should be connected directly to GND or VDD for address selection of four possible unique target ID addresses per the addressing scheme (see Table 8-2). The ALERT output pin can be connected to a microcontroller interrupt that triggers an event that occurred when the relative humidity or temperature limit exceeds the programmed value. The ALERT pin should be left floating when not in use.

It is generally best practice to solder the package thermal pad to a board pad that is connected to ground, however to minimize thermal mass for maximum heater efficiency or to measure ambient temperature it may be left floating.