4 Revision History
Changes from * Revision (December 2009) to A Revision
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Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
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Removed junction-to-ambient thermal resistance value for 8-pin DIP package, and updated SOIC package thermal information. Go