JAJSCM3E August   2006  – January 2021 INA193A-Q1 , INA194A-Q1 , INA195A-Q1 , INA196A-Q1 , INA197A-Q1 , INA198A-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Basic Connection
      2. 7.3.2 Selecting RS
      3. 7.3.3 Inside the INA19xA
      4. 7.3.4 Power Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Filtering
      2. 7.4.2 Accuracy Variations as a Result Of VSENSE and Common Mode Voltage
        1. 7.4.2.1 Normal Case 1: VSENSE ≥ 20 mV, VCM ≥ VS
        2. 7.4.2.2 Normal Case 2: VSENSE ≥ 20 mV, VCM < VS
        3. 7.4.2.3 Low VSENSE Case 1: VSENSE < 20 mV, –16 V ≤ VCM < 0; and Low VSENSE Case 3: VSENSE < 20 mV, VS < VCM ≤ 80 V
        4. 7.4.2.4 Low VSENSE Case 2: VSENSE < 20 mV, 0 V ≤ VCM ≤ VS
      3. 7.4.3 Shutdown
      4. 7.4.4 Transient Protection
      5. 7.4.5 Output Voltage Range
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 RFI/EMI
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)INA19xA-Q1UNIT
DBV (SOT-23)
5 PINS
RθJAJunction-to-ambient thermal resistance221.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance144.7°C/W
RθJBJunction-to-board thermal resistance49.7°C/W
ψJTJunction-to-top characterization parameter26.1°C/W
ψJBJunction-to-board characterization parameter49°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.