JAJSFH3E December   2017  – October 2019 ISO1042

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     アプリケーション図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions—16 Pins
    2.     Pin Functions—8 Pins
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Transient Immunity
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Ratings
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Safety Limiting Values
    10. 6.10 Electrical Characteristics - DC Specification
    11. 6.11 Switching Characteristics
    12. 6.12 Insulation Characteristics Curves
    13. 6.13 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CAN Bus States
      2. 8.3.2 Digital Inputs and Outputs: TXD (Input) and RXD (Output)
      3. 8.3.3 Protection Features
        1. 8.3.3.1 TXD Dominant Timeout (DTO)
        2. 8.3.3.2 Thermal Shutdown (TSD)
        3. 8.3.3.3 Undervoltage Lockout and Default State
        4. 8.3.3.4 Floating Pins
        5. 8.3.3.5 Unpowered Device
        6. 8.3.3.6 CAN Bus Short Circuit Current Limiting
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
        2. 9.2.2.2 CAN Termination
      3. 9.2.3 Application Curve
    3. 9.3 DeviceNet Application
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DWV|8
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

DW Package
16-Pin SOIC
Top View

Pin Functions—16 Pins

PIN I/O DESCRIPTION
NO. NAME
1 VCC1 — Digital-side supply voltage, Side 1
2 GND1 — Digital-side ground connection, Side 1
3 TXD I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
4 NC — Not connected
5 RXD O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
6 NC — Not connected
7 NC — Not connected
8 GND1 — Digital-side ground connection, Side 1
9 GND2 — Transceiver-side ground connection, Side 2
10
11 VCC2 — Transceiver-side supply voltage, Side 2. Must be externally connected to pin 16.
12 CANL I/O Low-level CAN bus line
13 CANH I/O High-level CAN bus line
14 NC — Not connected
15 GND2 — Transceiver-side ground connection, Side 2
16 VCC2 — Transceiver-side supply voltage, Side 2. Must be externally connected to pin 11.
DWV Package
8-Pin SOIC
Top View

Pin Functions—8 Pins

PIN I/O DESCRIPTION
NO. NAME
1 VCC1 — Digital-side supply voltage, Side 1
2 TXD I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
3 RXD O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
4 GND1 — Digital-side ground connection, Side 1
5 GND2 — Transceiver-side ground connection, Side 2
6 CANL I/O Low-level CAN bus line
7 CANH I/O High-level CAN bus line
8 VCC2 — Transceiver-side supply voltage, Side 2