JAJSVB9 September 2024 ISO6163
ADVANCE INFORMATION
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A minimum of two layers is required to accomplish a cost optimized and low EMI PCB design. To further improve EMI, a four layer board can be used (see Figure 8-7). Layer stacking for a four layer board must be in the following order (top-to-bottom): high-speed signal layer, ground plane, power plane and low-frequency signal layer.
If an additional supply voltage plane or signal layer is needed, add a second power or ground plane to the stack keeping the layers symmetrical. This makes the stack mechanically stable and prevents warping. The power and ground plane of each power domain can be placed closer together, thus increasing the high-frequency bypass capacitance.
For detailed layout recommendations, refer to the Digital Isolator Design Guide.