SLLS629M January   2006  – October 2024 ISO721 , ISO721M , ISO722 , ISO722M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Safety Limiting Values
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Electrical Characteristics, 5 V, 3.3 V
    10. 6.10 Electrical Characteristics, 5 V
    11. 6.11 Switching Characteristics, 3.3 V, 5 V
    12. 6.12 Electrical Characteristics, 3.3 V, 5 V
    13. 6.13 Electrical Characteristics, 3.3 V
    14. 6.14 Switching Characteristics, 3.3 V
    15. 6.15 Switching Characteristics, 5 V, 3.3 V
    16. 6.16 Switching Characteristics, 5 V
    17. 6.17 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 Device I/O Schematic
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Insulation Characteristics Curves
        2. 9.2.3.2 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) ISO72x UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance High-K Board 114.7 °C/W
Low-K Board 263
RθJC(top) Junction-to-case (top) thermal resistance 63 °C/W
RθJB Junction-to-board thermal resistance 54.8 °C/W
ψJT Junction-to-top characterization parameter 18.9 °C/W
ψJB Junction-to-board characterization parameter 54.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.