SLLSFK3 november   2022 ISOW7741-Q1 , ISOW7742-Q1

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Revision History
6. 5 Description (continued)
7. 6 Pin Configuration and Functions
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Power Ratings
   6. 7.6  Insulation Specifications
   7. 7.7  Safety-Related Certifications
   8. 7.8  Safety Limiting Values
   9. 7.9  Electrical Characteristics - Power Converter
   10. 7.10 Supply Current Characteristics - Power Converter
   11. 7.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
   12. 7.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
   13. 7.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
   14. 7.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
   15. 7.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
   16. 7.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
   17. 7.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
   18. 7.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
   19. 7.19 Switching Characteristics - 5-V Supply
   20. 7.20 Switching Characteristics - 3.3-V Supply
   21. 7.21 Switching Characteristics - 2.5-V Supply
   22. 7.22 Switching Characteristics - 1.8-V Supply
   23. 7.23 Insulation Characteristics Curves
   24. 7.24 Typical Characteristics
9. 8 Parameter Measurement Information
10. 9 Detailed Description
    1. 9.1 Overview
       1. 9.1.1 Power Isolation
       2. 9.1.2 Signal Isolation
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
       1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
       2. 9.3.2 Power-Up and Power-Down Behavior
       3. 9.3.3 Protection Features
    4. 9.4 Device Functional Modes
       1. 9.4.1 Device I/O Schematics
11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
       3. 10.2.3 Application Curve
       4. 10.2.4 Insulation Lifetime
12. 11Power Supply Recommendations
13. 12Layout
    1. 12.1 Layout Guidelines
       1. 12.1.1 PCB Material
    2. 12.2 Layout Example
14. 13Device and Documentation Support
    1. 13.1 Device Support
    2. 13.2 Documentation Support
       1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
15. 14Mechanical, Packaging, and Orderable Information