SNVS739F December   2011  – October 2016 LM10504

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - General
    6. 6.6  Electrical Characteristics - Buck 1
    7. 6.7  Electrical Characteristics - Buck 2
    8. 6.8  Electrical Characteristics - Buck 3
    9. 6.9  Electrical Characteristics - LDO
    10. 6.10 Electrical Characteristics - Comparators
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Regulators Description
      2. 7.3.2 PWM Operation
      3. 7.3.3 PFM Operation
      4. 7.3.4 Soft Start
      5. 7.3.5 Current Limiting
      6. 7.3.6 Internal Synchronous Rectification
      7. 7.3.7 Bypass-FET Operation on Buck 1 and Buck 2
      8. 7.3.8 Low Dropout Operation
      9. 7.3.9 Out of Regulation
    4. 7.4 Device Functional Modes
      1. 7.4.1  Start-Up Sequence
      2. 7.4.2  Power-On Default and Device Enable
      3. 7.4.3  Reset Pin Function
      4. 7.4.4  DevSLP Function
        1. 7.4.4.1 DevSLP Pin
        2. 7.4.4.2 DevSLP Programming Through SPI
        3. 7.4.4.3 DevSLP Operational Constraints
      5. 7.4.5  Vselect_B2, Vselect_B3 Function
      6. 7.4.6  Undervoltage Lockout (UVLO)
      7. 7.4.7  Overvoltage Lockout (OVLO)
      8. 7.4.8  Device Status, Interrupt Enable
      9. 7.4.9  Thermal Shutdown (TSD)
      10. 7.4.10 Comparator
    5. 7.5 Programming
    6. 7.6 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Components Selection
          1. 8.2.2.1.1 Output Inductors and Capacitors Selection
          2. 8.2.2.1.2 Inductor Selection
            1. 8.2.2.1.2.1 Recommended Method for Inductor Selection
            2. 8.2.2.1.2.2 Alternate Method for Inductor Selection
              1. 8.2.2.1.2.2.1 Suggested Inductors and Their Suppliers
          3. 8.2.2.1.3 Output and Input Capacitors Characteristics
            1. 8.2.2.1.3.1 Output Capacitor Selection
            2. 8.2.2.1.3.2 Input Capacitor Selection
        2. 8.2.2.2 Recommendations For Unused Functions and Pins
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout Thermal Dissipation For DSGBA Package
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.