JAJSB11H April   2009  – November 2014 LM25011 , LM25011-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     代表的なアプリケーション
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings: LM25011
    3. 6.3 Handling Ratings: LM25011-Q1
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Circuit Overview
      2. 7.3.2 On-Time Timer
      3. 7.3.3 Current Limit
      4. 7.3.4 Ripple Requirements
      5. 7.3.5 N-Channel Buck Switch and Driver
      6. 7.3.6 Soft-Start
      7. 7.3.7 Power Good Output (PGD)
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Function
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LM25011 Example Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH Tools
          2. 8.2.1.2.2 External Components
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Output Ripple Control
        1. 8.2.2.1 Option A: Lowest Cost Configuration
        2. 8.2.2.2 Option B: Intermediate VOUT Ripple Configuration
        3. 8.2.2.3 Option C: Minimum VOUT Ripple Configuration
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 WEBENCHツールによるカスタム設計
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 関連リンク
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.3 Power Dissipation

The power dissipation within the LM25011 can be approximated by determining the total conversion loss (PIN – POUT) of the circuit, and then subtracting the power losses in the free-wheeling diode, the sense resistor, and the inductor. The power loss in the diode is approximately:

Equation 26. PD1 = IOUT × VF × (1 – D)

where IOUT is the load current, VF is the forward voltage drop of the diode, and D is the on-time duty cycle. The power loss in the sense resistor is:

Equation 27. PRS = (IOUT)2 × RS × (1 – D)

The power loss in the inductor is approximately:

Equation 28. PL1 = IOUT2 × RL × 1.1

where RL is the dc resistance of the inductor, and the 1.1 factor is an approximation for the ac losses. If it is expected that the internal dissipation of the LM25011 will produce excessive junction temperatures during normal operation, good use of the ground plane of the PC board can help to dissipate heat. Additionally the use of wide PC board traces, where possible, can help conduct heat away from the IC pins. Judicious positioning of the PC board within the end product, along with the use of any available air flow (forced or natural convection) can help reduce the junction temperature.