JAJSAP6I June   2007  – September 2018 LM2735

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的な昇圧アプリケーションの回路
      2.      効率と負荷電流との関係VO＝12V
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings: LM2735
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Theory of Operation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit
      2. 7.3.2 Thermal Shutdown
      3. 7.3.3 Soft Start
      4. 7.3.4 Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  LM2735X SOT-23 Design Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input Capacitor
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Setting the Output Voltage
        3. 8.2.1.3 Application Curves
      2. 8.2.2  LM2735Y SOT-23 Design Example 2
      3. 8.2.3  LM2735X WSON Design Example 3
      4. 8.2.4  LM2735Y WSON Design Example 4
      5. 8.2.5  LM2735Y MSOP-PowerPAD Design Example 5
      6. 8.2.6  LM2735X SOT-23 Design Example 6
      7. 8.2.7  LM2735Y SOT-23 Design Example 7
      8. 8.2.8  LM2735X SOT-23 Design Example 8
      9. 8.2.9  LM2735Y SOT-23 Design Example 9
      10. 8.2.10 LM2735X WSON Design Example 10
      11. 8.2.11 LM2735Y WSON Design Example 11
      12. 8.2.12 LM2735X WSON SEPIC Design Example 12
      13. 8.2.13 LM2735Y MSOP-PowerPAD SEPIC Design Example 13
      14. 8.2.14 LM2735X SOT-23 LED Design Example 14
      15. 8.2.15 LM2735Y WSON FlyBack Design Example 15
      16. 8.2.16 LM2735X SOT-23 LED Design Example 16 VRAIL > 5.5 V Application
      17. 8.2.17 LM2735X SOT-23 LED Design Example 17 Two-Input Voltage Rail Application
      18. 8.2.18 SEPIC Converter
        1. 8.2.18.1 Detailed Design Procedure
          1. 8.2.18.1.1 SEPIC Design Guide
          2. 8.2.18.1.2 Small Ripple Approximation
          3. 8.2.18.1.3 Steady State Analysis With Loss Elements
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 WSON Package
    2. 10.2 Layout Examples
    3. 10.3 Thermal Considerations
      1. 10.3.1 Definitions
      2. 10.3.2 PCB Design With Thermal Performance in Mind
      3. 10.3.3 LM2735 Thermal Models
      4. 10.3.4 Calculating Efficiency, and Junction Temperature
        1. 10.3.4.1 Example Efficiency Calculation
      5. 10.3.5 Calculating RθJA and RΨJC
        1. 10.3.5.1 Procedure
        2. 10.3.5.2 Example From Previous Calculations
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 開発サポート
        1. 11.1.2.1 WEBENCH®ツールによるカスタム設計
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.3.2 PCB Design With Thermal Performance in Mind

The PCB design is a very important step in the thermal design procedure. The LM2735 is available in three package options (5-pin SOT-23, 8-pin MSOP-PowerPAD, and 6-pin WSON). The options are electrically the same, but difference between the packages is size and thermal performance. The WSON and MSOP-PowerPAD have thermal Die Attach Pads (DAP) attached to the bottom of the packages, and are therefore capable of dissipating more heat than the SOT-23 package. It is important that the correct package for the application is chosen. A detailed thermal design procedure has been included in this data sheet. This procedure will help determine which package is correct, and common applications will be analyzed.

There is one significant thermal PCB layout design consideration that contradicts a proper electrical PCB layout design consideration. This contradiction is the placement of external components that dissipate heat. The greatest external heat contributor is the external Schottky diode. It would be ideal to be able to separate by distance the LM2735 from the Schottky diode, and thereby reducing the mutual heating effect, however, this will create electrical performance issues. It is important to keep the LM2735, the output capacitor, and Schottky diode physically close to each other (see Figure 44). The electrical design considerations outweigh the thermal considerations. Other factors that influence thermal performance are thermal vias, copper weight, and number of board layers.