JAJSAM0A October   2006  – September 2017 LM2853

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Input Capacitor (CIN)
      2. 8.1.2  Soft-Start Capacitor (CSS)
      3. 8.1.3  Soft-Start Capacitor (CSS) and Fault Conditions
      4. 8.1.4  Compensation
      5. 8.1.5  Output Filter Values
      6. 8.1.6  Choosing an Inductance Value
      7. 8.1.7  Output Filter Inductors
      8. 8.1.8  Output Filter Capacitors
      9. 8.1.9  Split-Rail Operation
      10. 8.1.10 Switch Node Protection
    2. 8.2 Typical Application
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Example Circuit Schematic and Bill of Materials
  10. 10デバイスおよびドキュメントのサポート
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 コミュニティ・リソース
    3. 10.3 商標
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 Glossary
  11. 11メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

9 Layout

9.1 Layout Guidelines

These are several guidelines to follow while designing the PCB layout for an LM2853 application.

  1. The input bulk capacitor, CIN, should be placed very close to the PVIN pin to keep the resistance as low as possible between the capacitor and the pin. High current levels will be present in this connection.
  2. All ground connections must be tied together. Use a broad ground plane, for example a completely filled back plane, to establish the lowest resistance possible between all ground connections.
  3. The sense pin connection should be made as close to the load as possible so that the voltage at the load is the expected regulated value. The sense line should not run too close to nodes with high dV/dt or dl/dt (such as the switch node) to minimize interference.
  4. The switch node connections should be low resistance to reduce power losses. Low resistance means the trace between the switch pin and the inductor should be wide. However, the area of the switch node should not be too large since EMI increases with greater area. So connect the inductor to the switch pin with a short, but wide trace. Other high current connections in the application such as PVIN and VOUT assume the same trade off between low resistance and EMI.
  5. Allow area under the chip to solder the entire exposed die attach pad to ground for improved thermal performance. Lab measurements also show improved regulation performance when the exposed pad is well grounded.

9.2 Example Circuit Schematic and Bill of Materials

LM2853 20201514.gif Figure 11. LM2853 Example Circuit Schematic

Table 4. Bill of Materials for 5 V to 3.3 V Conversion

ID PART NUMBER TYPE SIZE PARAMETERS QTY VENDOR
U1 LM2853MH-3.3 3A Buck HTSSOP-14 3.3 V 1 TI
CIN GRM31CR60J476ME19 Capacitor 1206 47 µF 1 Murata
CBYP GRM21BR71C105KA01 Capacitor 0805 1 µF 1 Murata
CSS VJ0805Y222KXXA Capacitor 0603 2.2 nF 1 Vishay-Vitramon
LO DO3316P-682 Inductor DO3316P 6.8 µH 1 Coilcraft
CO 594D127X06R3C2T Capacitor C Case 120 μF (85 mΩ) 1 Vishay-Sprague

Table 5. Bill of Materials for 3.3 V to 1.2 V Conversion

ID PART NUMBER TYPE SIZE PARAMETERS QTY VENDOR
U1 LM2853MH-1.2 3A Buck HTSSOP-14 1.2 V 1 TI
CIN GRM31CR60J476ME19 Capacitor 1206 47 µF 1 Murata
CBYP GRM21BR71C105KA01 Capacitor 0805 1 µF 1 Murata
CSS VJ0805Y222KXXA Capacitor 0603 2.2 nF 1 Vishay-Vitramon
LO DO3316P-472 Inductor DO3316P 4.7 μH 1 Coilcraft
CO NOSD157M006R0070 Capacitor D Case 150 μF (70 mΩ) 1 AVX