SNVS678F June   2010  – November 2015 LM3414 , LM3414HV

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pulse-Level-Modulation (PLM) Operation Principles
      2. 7.3.2 Minimum Switch ON-time
      3. 7.3.3 Peak Switch Current Limit
      4. 7.3.4 PWM Dimming Control
      5. 7.3.5 Analog Dimming Control
      6. 7.3.6 Internal VCC Regulator
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Setting the Switching Frequency
      2. 8.1.2 Setting LED Current
      3. 8.1.3 Inductor Selection
    2. 8.2 Typical Applications
      1. 8.2.1 LM3414/HV Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calculate Operating Parameters
          2. 8.2.1.2.2 Calculate RIADJ
          3. 8.2.1.2.3 Calculate RFS
          4. 8.2.1.2.4 Calculate LMIN
          5. 8.2.1.2.5 Calculate CIN-MIN
      2. 8.2.2 LM3414/HV Design Example (IOUT = 1 A)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Calculate Operating Parameters
          2. 8.2.2.2.2 Calculate RIADJ
          3. 8.2.2.2.3 Calculate RFS
          4. 8.2.2.2.4 Calculate LMIN
          5. 8.2.2.2.5 Calculate CIN-MIN
        3. 8.2.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN to GND LM3414 –0.3 42 V
LM3414HV –0.3 65
VIN to GND (Transient) LM3414 45 (500 ms) V
LM3414HV 67 (500 ms)
LX to PGND LM3414 –0.3 42 V
LM3414HV –0.3 65
LX to PGND (Transient) LM3414 –3 (2 ns) 45 (500 ms) V
LM3414HV –3 (2 ns) 67 (500 ms)
FS, IADJ to GND –0.3 5 V
DIM to GND –0.3 6 V
Storage Temperature –65 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
WSON PACKAGE
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
SOIC PACKAGE
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(3) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN LM3414 4.5 42 V
LM3414HV 4.5 65
Junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) LM3414, LM3414HV UNIT
NGQ (WSON) DDA (SOIC-8)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 47.7 50.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.1 55.7 °C/W
RθJB Junction-to-board thermal resistance 22.3 28.6 °C/W
ψJT Junction-to-top characterization parameter 0.4 9.5 °C/W
ψJB Junction-to-board characterization parameter 22.5 28.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4 3.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

MIN and MAX limits apply for TJ = –40°C to 125°C unless specified otherwise. VIN = 24 V unless otherwise indicated.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
SYSTEM PARAMETERS - LM3414
IIN-DIM-HIGH Operating Current 4.5 V ≤ Vin ≤ 42 V
RIADJ = 3.125 kΩ
VDIM = High		 2.2 3.2 3.5 mA
IIN-DIM-LOW Standby Current 4.5 V ≤ Vin ≤ 42 V
RIADJ = 3.125 kΩ
VDIM = Low		 0.8 1.15 1.4 mA
ILX-OFF LX Pin Current Main Switch Turned OFF
VLX = VIN = 42 V		 6 µA
SYSTEM PARAMETERS - LM3414HV
IIN-DIM-HIGH Operating Current 4.5 V ≤ Vin ≤ 65 V
RIADJ = 3.125 kΩ
VDIM = High		 2.2 3.3 3.6 mA
IIN-DIM-LOW Standby Current 4.5 V ≤ Vin ≤ 65 V
RIADJ = 3.125 kΩ
VDIM = Low		 0.8 1.2 1.45 mA
ILX-OFF LX Pin Current Main Switch Turned OFF
VLX = VIN= 65 V		 6.5 µA
SYSTEM PARAMETERS - LM3414/3414HV
ILED Average LED Current RIADJ = 3.125 kΩ
TA = 25°C		 0.97 1 1.03 A
RIADJ = 3.125 kΩ
TA = –40°C to 125°C		 0.95 1 1.05 A
VCC-UVLO Vcc UVLO Threshold VCC Decreasing, TA = 25°C 3.6 3.75 3.9 V
VCC-UVLO-HYS Vcc UVLO Hysteresis 300 mV
VIADJ IADJ Pin voltage 1.23 1.255 1.280 V
VDIM DIM Pin Threshold VDIM Increasing 1 1.2 V
VDIM-HYS DIM Pin Hysteresis 100 mV
fSW Switching frequency 250 500 1000 kHz
fSW-TOL Switching frequency tolerance RFS = 40 kΩ 420 500 580 kHz
tON-MIN Minimum on-time 400 ns
INTERNAL VOLTAGE REGULATOR
VCC VCC regulator output voltage(3) CVCC = 1 µF, No Load to IVCC = 2 mA 4.7 5.4 6 V
VIN = 4.5 V, 2-mA Load 3.8 4.2 V
MAIN SWITCH
RLX Resistance across LX and GND Main Switch Turned ON 1.8 Ω
THERMAL PROTECTION
TSD Thermal shutdown temperature TJ Rising 170 °C
TSD-HYS Thermal shutdown temperature hysteresis TJ Falling 10 °C
(1) All limits specified at room temperature (TYP) and at temperature extremes (MIN/MAX). All room temperature limits are 100% production tested. All limits at temperature extremes are specified through correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) Typical specification represent the most likely parametric norm at 25°C operation.
(3) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading to the pin.

6.6 Typical Characteristics

All curves taken at VIN = 48 V with configuration in typical application for driving twelve power LEDs with ILED = 1 A shown in this data sheet. TA = 25°C, unless otherwise specified.
LM3414 LM3414HV 30124843.png
Figure 1. IOUT vs VIN, (4 - 8 LED), LM3414HV
LM3414 LM3414HV 30124859.png
Figure 3. Efficiency vs VIN, (4 - 8 LED), LM3414HV
LM3414 LM3414HV 30124841.png
Figure 5. IOUT vs Temperature (TA)
(6 LED, VIN = 24 V), LM3414HV
LM3414 LM3414HV 30124839.png
Figure 7. VCC vs Temperature (TA), LM3414HV
LM3414 LM3414HV 30124816.png
Figure 9. IOUT and VLX, LM3414HV
LM3414 LM3414HV 30124856.png
Figure 11. LED Current With PWM Dimming (VDIM Rising), LM3414HV
LM3414 LM3414HV 30124858.png
Figure 13. LED Current With PWM Dimming (9-µs dimming pulse), LM3414HV
LM3414 LM3414HV 30124844.png
Figure 2. IOUT vs VIN, (10 - 18 LED), LM3414HV
LM3414 LM3414HV 30124860.png
Figure 4. Efficiency vs VIN, (10 - 18 LED), LM3414HV
LM3414 LM3414HV 30124842.png
Figure 6. IOUT vs Temperature (TA)
(12 LED, VIN = 48 V), LM3414HV
LM3414 LM3414HV 30124840.png
Figure 8. VIADJ vs Temperature (TA), LM3414HV
LM3414 LM3414HV 30124817.png
Figure 10. ILX and VDIM, LM3414HV
LM3414 LM3414HV 30124857.png
Figure 12. LED Current With PWM Dimming (VDIM Falling), LM3414HV