SNVS594G December   2008  – April 2016 LM3555

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Control Interface Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Synchronous Boost Converter
      2. 7.3.2  High-Side Current Source
      3. 7.3.3  I2C/EN Pin
      4. 7.3.4  SDA/EN2 and SCL/EN1 Pins
      5. 7.3.5  STROBE Pin
      6. 7.3.6  TORCH Pin
      7. 7.3.7  Indicator LED Pin (IND)
      8. 7.3.8  Internal Diode Detection
      9. 7.3.9  Fault Protections
        1. 7.3.9.1 Output Overvoltage Protection (OVP)
        2. 7.3.9.2 Output and LED Short-Circuit Protection (SCP)
        3. 7.3.9.3 Overtemperature Protection (OTP)
        4. 7.3.9.4 Flash Timeout (FTP)
        5. 7.3.9.5 Indicator Fault (IF)
        6. 7.3.9.6 Broken Inductor Fault (IP)
      10. 7.3.10 Undervoltage Lockout (UVLO)
      11. 7.3.11 Power-On Reset (POR)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Single LED Operation
      2. 7.4.2 Dual LED Operation
      3. 7.4.3 Torch or Assist (Continuous Current) Operation
      4. 7.4.4 Flash (Pulsed Current) Operation
      5. 7.4.5 Indicator Operation
      6. 7.4.6 Simple Control State Diagram
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
    6. 7.6 Register Maps
      1. 7.6.1 Internal Registers of LM3555
      2. 7.6.2 Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Current Limit
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For additional information, see the following:

    AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.