SNVSA63A April   2015  – September 2015 LM3632A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements (SDA, SCL)
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Backlight
        1. 7.3.1.1 Brightness Control
          1. 7.3.1.1.1 LED Current with PWM Disabled
          2. 7.3.1.1.2 LED Current with PWM Enabled
        2. 7.3.1.2 Sloper
        3. 7.3.1.3 Mapper
        4. 7.3.1.4 PWM Input
        5. 7.3.1.5 PWM Minimum On/Off Time
        6. 7.3.1.6 PWM Resolution and Input Frequency Range
        7. 7.3.1.7 PWM Hysteresis
        8. 7.3.1.8 PWM Timeout
        9. 7.3.1.9 Backlight Boost Converter
          1. 7.3.1.9.1 Headroom Voltage
          2. 7.3.1.9.2 Backlight Protection and Faults
            1. 7.3.1.9.2.1 Overvoltage Protection (OVP) and Open-Load Fault Protection
            2. 7.3.1.9.2.2 Overcurrent Protection (OCP) and Overcurrent Protection Flag
      2. 7.3.2 LCM Bias
        1. 7.3.2.1 Display Bias Boost Converter (VVPOS, VVNEG)
        2. 7.3.2.2 Auto Sequence Mode
        3. 7.3.2.3 Wake-up Mode
        4. 7.3.2.4 Active Discharge
        5. 7.3.2.5 LCM Bias Protection and Faults
          1. 7.3.2.5.1 LCM Overvoltage Protection
          2. 7.3.2.5.2 VNEG Overvoltage Protection
          3. 7.3.2.5.3 VPOS Short Circuit Protection
          4. 7.3.2.5.4 VNEG Short Circuit Protection
      3. 7.3.3 Flash
        1. 7.3.3.1 Flash Boost Converter
        2. 7.3.3.2 Start-Up (Enabling The Device)
        3. 7.3.3.3 Pass Mode
        4. 7.3.3.4 Flash Mode
        5. 7.3.3.5 Torch Mode
        6. 7.3.3.6 Power Amplifier Synchronization (TX)
        7. 7.3.3.7 VIN Monitor
        8. 7.3.3.8 Flash Fault Protections
          1. 7.3.3.8.1 Fault Operation
          2. 7.3.3.8.2 Flash Time-Out
          3. 7.3.3.8.3 Overvoltage Protection (OVP)
          4. 7.3.3.8.4 Current Limit
          5. 7.3.3.8.5 FLED and/or FL_OUT Short Fault
      4. 7.3.4 Software RESET
      5. 7.3.5 EN Input
      6. 7.3.6 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Serial Bus Interface
        1. 7.5.1.1 Interface Bus Overview
        2. 7.5.1.2 Data Transactions
        3. 7.5.1.3 Acknowledge Cycle
        4. 7.5.1.4 Acknowledge After Every Byte Rule
        5. 7.5.1.5 Addressing Transfer Formats
    6. 7.6 Register Maps
      1. 7.6.1  Revision (Address = 0x01) [reset = 0x09]
      2. 7.6.2  Backlight Configuration1 (Address = 0x02) [reset = 0x30]
      3. 7.6.3  Backlight Configuration2 (Address = 0x03) [reset = 0x0D]
      4. 7.6.4  Backlight Brightness LSB (Address = 0x04) [reset = 0x07]
      5. 7.6.5  Backlight Brightness MSB (Address = 0x05) [reset = 0xFF]
      6. 7.6.6  Flash/Torch Current (Address = 0x06) [reset = 0x3E]
      7. 7.6.7  Flash Configuration (Address = 0x07) [reset = 0x2F]
      8. 7.6.8  VIN Monitor (Address = 0x08) [reset = 0x03]
      9. 7.6.9  I/O Control (Address = 0x09) [reset = 0x00]
      10. 7.6.10 Enable (Address = 0x0A) [reset = 0x00]
      11. 7.6.11 Flags1 (Address = 0x0B) [reset = 0x00]
      12. 7.6.12 Display Bias Configuration (Address = 0x0C) [reset = 0x18]
      13. 7.6.13 LCM Boost Bias (Address = 0x0D) [reset = 0x1E]
      14. 7.6.14 VPOS Bias (Address = 0x0E) [reset = 0x1E]
      15. 7.6.15 VNEG Bias (Address = 0x0F) [reset = 0x1C]
      16. 7.6.16 Flags2 (Address = 0x10) [reset = 0x00]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Components
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Boost Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Backlight Curves
        2. 8.2.3.2 LCM Bias Curves
        3. 8.2.3.3 Flash Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10 Layout

10.1 Layout Guidelines

  • Place the boost converters output capacitors as close to the output voltage and GND pins as possible.
  • Minimize the boost converter switching loops by placing the input capacitors and inductors close to GND and switch pins.
  • If possible, route the switching loops on top layer only. For best efficiency, try to minimize copper on the switch node to minimize switch pin parasitic capacitance while preserving adequate routing width.
  • VIN input voltage pin needs to be bypassed to ground with a low-ESR bypass capacitor. Place the capacitor as close to VIN pin as possible.
  • Place the output capacitor of the LDO as close to the output pins as possible. Also place the charge pump flying capacitor and output capacitor close to their respective pins.
  • Terminate the Flash LED cathode directly to the Flash GND pin of the LM3632A. If possible, route the LED return with a dedicated path so as to keep the high amplitude LED current out of the GND plane.
  • Route the internal pins on the second layer. Use offset micro vias to go from top layer to mid-layer1. Avoid routing the signal traces directly under the switching loops of the boost converters.

10.2 Layout Example

LM3632A LM3632_layout.gif