JAJSGD0I April   2004  – October 2018 LM5008

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     Device Images
      1.      代表的なアプリケーション回路とブロック図
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hysteretic Control Circuit Overview
      2. 7.3.2 High Voltage Start-Up Regulator
      3. 7.3.3 Regulation Comparator
      4. 7.3.4 Overvoltage Comparator
      5. 7.3.5 On-Time Generator and Shutdown
      6. 7.3.6 Current Limit
      7. 7.3.7 N-Channel Buck Switch and Driver
      8. 7.3.8 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Minimum Load Current
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 WEBENCH®ツールによるカスタム設計
      3. 11.1.3 開発サポート
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
        1. 11.2.1.1 PCBレイアウトについてのリソース
        2. 11.2.1.2 熱設計についてのリソース
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

The LM5008 regulation and overvoltage comparators are very fast, and as such responds to short-duration noise pulses. Layout considerations are therefore critical for optimum performance:

  1. Minimize the area of the high di/dt switching current loop consisting of the VIN pin, input ceramic capacitor, SW node and freewheeling power diode. Keep the input capacitor as close as possible to the VIN pin and route a short, direct connection to the RTN pin using polygon copper pours.
  2. Minimize SW copper area to reduce radiated noise related to high dv/dt.
  3. Locate all components as physically close as possible to their respective pins, thereby minimizing noise pickup in the printed-circuit tracks.
  4. Locate the FB trace away from noise sources and inductors. Place the resistor close to the FB pin to minimize the length of the FB trace.

If the internal dissipation of the LM5008 converter produces excessive junction temperatures during normal operation, optimal use of the PCB ground plane can help considerably to dissipate heat. The exposed pad on the bottom of the WSON-8 package can be soldered to a ground plane on the PCB, and that plane should extend out from beneath the IC to help dissipate the heat. Additionally, the use of wide PCB traces for power connection can also help conduct heat away from the IC. Judicious positioning of the LM5008 converter within the end product, along with use of any available air flow (forced or natural convection), can help reduce the operating junction temperature.