JAJSO81 October   2022 LM5013

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings_Catalog
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristivcs
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Control Architecture
      2. 8.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 8.3.3  Regulation Comparator
      4. 8.3.4  Internal Soft Start
      5. 8.3.5  On-Time Generator
      6. 8.3.6  Current Limit
      7. 8.3.7  N-Channel Buck Switch and Driver
      8. 8.3.8  Schottky Diode Selection
      9. 8.3.9  Enable and Undervoltage Lockout (EN/UVLO)
      10. 8.3.10 Power Good (PGOOD)
      11. 8.3.11 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Active Mode
      4. 8.4.4 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Switching Frequency (RRON)
        3. 9.2.2.3 Buck Inductor (LO)
        4. 9.2.2.4 Schottky Diode (DSW)
        5. 9.2.2.5 Output Capacitor (COUT)
        6. 9.2.2.6 Input Capacitor (CIN)
        7. 9.2.2.7 Type 3 Ripple Network
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Compact PCB Layout for EMI Reduction
        2. 9.4.1.2 Feedback Resistors
      2. 9.4.2 Layout Example
        1. 9.4.2.1 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.5 Trademarks

PowerPAD™ and TI E2E™ are trademarks of Texas Instruments.

WEBENCH® is a registered trademark of Texas Instruments.

All trademarks are the property of their respective owners.