JAJSJK6D
October 2007 – August 2020
LM5067
PRODUCTION DATA
1
特長
2
アプリケーション
3
概要
4
Revision History
5
Device Comparison
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Switching Characteristics
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Power Up Sequence
8.3.2
Gate Control
8.3.3
Current Limit
8.3.4
Circuit Breaker
8.3.5
Power Limit
8.3.6
Fault Timer and Restart
8.3.7
Undervoltage Lock-Out (UVLO)
8.3.8
Overvoltage Lock-Out (OVLO)
8.3.9
Power Good Pin
8.4
Device Functional Modes
8.4.1
Shutdown / Enable Control
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
RIN, CIN
9.2.2.2
Current Limit, RS
9.2.2.3
Power Limit Threshold
9.2.2.4
Turn-On Time
9.2.2.4.1
Turn-on With Current Limit Only
9.2.2.4.2
Turn-on With Power Limit and Current Limit
9.2.2.5
MOSFET Selection
9.2.2.6
Timer Capacitor, CT
9.2.2.6.1
Insertion Delay
9.2.2.6.2
Fault Timeout Period
9.2.2.6.3
Restart Timing
9.2.2.7
UVLO, OVLO
9.2.2.7.1
Option A:
9.2.2.7.2
Option B:
9.2.2.7.3
Option C:
9.2.2.7.4
Option D:
9.2.2.8
Thermal Considerations
9.2.2.9
System Considerations
9.2.2.9.1
System Considerations During Surge Events
9.2.2.10
Power Good Pin
9.2.3
Application Curves
10
Power Supply Recommendations
10.1
Operating Voltage
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Trademarks
12.2
静電気放電に関する注意事項
12.3
Glossary
13
Mechanical, Packaging, and Orderable Information
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
NPA|14
MPDS386
DGS|10
MPDS035C
サーマルパッド・メカニカル・データ
発注情報
jajsjk6d_oa
jajsjk6d_pm
7.4
Thermal Information
THERMAL METRIC
(1)
(2)
LM5067
UNIT
VSSOP
SOIC
10 PINS
14 PINS
R
θJA
Junction-to-ambient thermal resistance
94
90
°C/W
R
θJC
Junction-to-case thermal resistance
44
27
(1)
For more information about traditional and new thermal metrics, see the
Semiconductor and IC package thermal metrics
application report
.
(2)
Tested on a 4 layer JEDEC board with 2 vias under the package. See JEDEC standards JESD51-7 and JESD51-3. See the Thermal Considerations section.