JAJSC58H July   2004  – September 2016 LM5111

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 デバイスのオプション
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout
      2. 8.3.2 Output Stage
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VCC
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bias Supply Voltage
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Drive Power Requirement Calculations in LM5111
      2. 11.3.2 Continuous Current Rating of LM5111
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントの更新通知を受け取る方法
    2. 12.2 コミュニティ・リソース
    3. 12.3 商標
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6 Pin Configuration and Functions

D and DGN Package
8-Pin SOIC and MSOP-PowerPAD
Top View
LM5111 20112301.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
IN_A 2 I ‘A’ side control input. TTL compatible thresholds.
IN_B 4 I ‘B’ side control input. TTL compatible thresholds.
OUT_A. 7 O Output for the ‘A’ side driver. Voltage swing of this output is from VCC to VEE. The output stage is capable of sourcing 3 A and sinking 5 A.
OUT_B 5 O Output for the ‘B’ side driver. Voltage swing of this output is from VCC to VEE. The output stage is capable of sourcing 3 A and sinking 5 A.
VCC 6 — Positive output supply. Locally decouple to VEE.
VEE 3 — Ground reference for both inputs and outputs. Connect to power ground.
NC 1, 8 — No Connection
Exposed Pad(1) — It is recommended that the exposed pad on the bottom of the package be soldered to ground plane on the PC board to aid thermal dissipation.
(1) Only available with the MSOP-PowerPAD package.