JAJSC59C September   2004  – September 2016 LM5112 , LM5112-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
  4. 改訂履歴
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inverting Mode
      2. 7.4.2 Non-Inverting Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Thermal Considerations
        1. 10.1.1.1 Drive Power Requirement Calculations In LM5112
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 関連リンク
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • NGG|6
サーマルパッド・メカニカル・データ

5 Pin Configuration and Functions

NGG Package
6-Pin WSON
Top View
DGN Package
8-Pin MSOP PowerPAD
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME WSON MSOP
Exposed Pad Exposed pad, underside of package: Internally bonded to the die substrate. Connect to VEE ground pin for low thermal impedance.
IN 1 4 I Non-inverting input pin: TTL compatible thresholds. Pull up to VCC when not used.
INB 6 2 I Inverting input pin: TTL compatible thresholds. Connect to IN_REF when not used.
IN_REF 5 1 Ground reference for control inputs: Connect to power ground (VEE) for standard positive only output voltage swing. Connect to system logic ground when VEE is connected to a negative gate drive supply.
N/C 5, 8 Not internally connected
OUT 4 7 O Gate drive output: Capable of sourcing 3 A and sinking 7 A. Voltage swing of this output is from VEE to VCC.
VCC 3 6 I Positive supply voltage input: Locally decouple to VEE. The decoupling capacitor must be placed close to the chip.
VEE 2 3 Power ground for driver outputs: Connect to either power ground or a negative gate drive supply for positive or negative voltage swing.