JAJSKV7A June   2021  – September 2022 LM5168-Q1 , LM5169-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Control Architecture
      2. 8.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 8.3.3  Internal Soft Start
      4. 8.3.4  On-Time Generator
      5. 8.3.5  Current Limit
      6. 8.3.6  N-Channel Buck Switch and Driver
      7. 8.3.7  Synchronous Rectifier
      8. 8.3.8  Enable, Undervoltage Lockout (EN/UVLO)
      9. 8.3.9  Power Good (PGOOD)
      10. 8.3.10 Thermal Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Fly-Buck™ Converter Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Switching Frequency (RT)
        2. 9.2.2.2  Transformer Selection
        3. 9.2.2.3  Output Capacitor Selection
        4. 9.2.2.4  Secondary Output Diode
        5. 9.2.2.5  Setting Output Voltage
        6. 9.2.2.6  Input Capacitor
        7. 9.2.2.7  Type-3 Ripple Network
        8. 9.2.2.8  CBST Selection
        9. 9.2.2.9  Minimum Secondary Output Load
        10. 9.2.2.10 Example Design Summary
      3. 9.2.3 Application Curves
    3. 9.3 Typical Buck Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Switching Frequency (RT)
        2. 9.3.2.2 Buck Inductor Selection
        3. 9.3.2.3 Setting the Output Voltage
        4. 9.3.2.4 Type-3 Ripple Network
        5. 9.3.2.5 Output Capacitor Selection
        6. 9.3.2.6 Input Capacitor Considerations
        7. 9.3.2.7 CBST Selection
        8. 9.3.2.8 Example Design Summary
      3. 9.3.3 Application Curves
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Thermal Considerations
      2. 9.5.2 Typical EMI Results
      3. 9.5.3 Layout Guidelines
        1. 9.5.3.1 Compact PCB Layout for EMI Reduction
        2. 9.5.3.2 Feedback Resistors
      4. 9.5.4 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) LM516x-Q1 UNIT
DDA (SOIC)
8 PINS
RθJA(EVM) Junction-to-ambient thermal resistance for LM5168PEVM(2) 22 °C/W
RθJA Junction-to-ambient thermal resistance 38.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.7 °C/W
ψJT Junction-to-top characterization parameter 2.9 °C/W
RθJB Junction-to-board thermal resistance 14.1 °C/W
ψJB Junction-to-board characterization parameter 14.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics
(2) This value is obtained on the LM5168PEVM with approximaetly 49 cm2 of copper area.  See Thermal considerations section for more information.