JAJSNH1B December   2021  – December 2024 LM5168 , LM5169

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Control Architecture
      2. 7.3.2  Internal VCC Regulator and Bootstrap Capacitor
      3. 7.3.3  Internal Soft Start
      4. 7.3.4  On-Time Generator
      5. 7.3.5  Current Limit
      6. 7.3.6  N-Channel Buck Switch and Driver
      7. 7.3.7  Synchronous Rectifier
      8. 7.3.8  Enable, Undervoltage Lockout (EN/UVLO)
      9. 7.3.9  Power Good (PGOOD)
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Sleep Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Fly-Buck™ Converter Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency (RT)
        2. 8.2.2.2  Transformer Selection
        3. 8.2.2.3  Output Capacitor Selection
        4. 8.2.2.4  Secondary Output Diode
        5. 8.2.2.5  Setting Output Voltage
        6. 8.2.2.6  Input Capacitor
        7. 8.2.2.7  Type-3 Ripple Network
        8. 8.2.2.8  CBST Selection
        9. 8.2.2.9  Minimum Secondary Output Load
        10. 8.2.2.10 Example Design Summary
      3. 8.2.3 Application Curves
    3. 8.3 Typical Buck Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
        1. 8.3.2.1 Switching Frequency (RT)
        2. 8.3.2.2 Buck Inductor Selection
        3. 8.3.2.3 Setting the Output Voltage
        4. 8.3.2.4 Type-3 Ripple Network
        5. 8.3.2.5 Output Capacitor Selection
        6. 8.3.2.6 Input Capacitor Considerations
        7. 8.3.2.7 CBST Selection
        8. 8.3.2.8 Example Design Summary
      3. 8.3.3 Application Curves
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Thermal Considerations
      2. 8.5.2 Typical EMI Results
      3. 8.5.3 Layout Guidelines
        1. 8.5.3.1 Compact PCB Layout for EMI Reduction
        2. 8.5.3.2 Feedback Resistors
      4. 8.5.4 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 サード・パーティ製品に関する免責事項
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 ドキュメントの更新通知を受け取る方法
    4. 9.4 サポート・リソース
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7 Detailed Description