JAJSOR1E June   2022  – August 2024 LM5177

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Gate Driver Rise Time and Fall Time
    2. 6.2 Gate Driver Dead (Transition) Time
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power-On Reset (POR System)
      2. 7.3.2  Buck-Boost Control Scheme
        1. 7.3.2.1 Boost Mode
        2. 7.3.2.2 Buck Mode
        3. 7.3.2.3 Buck-Boost Mode
      3. 7.3.3  Power Save Mode
      4. 7.3.4  Supply Voltage Selection – VMAX Switch
      5. 7.3.5  Enable and Undervoltage Lockout
      6. 7.3.6  Oscillator Frequency Selection
      7. 7.3.7  Frequency Synchronization
      8. 7.3.8  Voltage Regulation Loop
      9. 7.3.9  Output Voltage Tracking
      10. 7.3.10 Slope Compensation
      11. 7.3.11 Configurable Soft Start
      12. 7.3.12 Peak Current Sensor
      13. 7.3.13 Current Monitoring and Current Limit Control Loop
      14. 7.3.14 Short Circuit - Hiccup Protection
      15. 7.3.15 nFLT Pin and Protections
      16. 7.3.16 Device Configuration Pin
      17. 7.3.17 Dual Random Spread Spectrum – DRSS
      18. 7.3.18 Gate Driver
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH Tools
        2. 8.2.2.2  Frequency
        3. 8.2.2.3  Feedback Divider
        4. 8.2.2.4  Inductor and Current Sense Resistor Selection
        5. 8.2.2.5  Slope Compensation
        6. 8.2.2.6  Output Capacitor
        7. 8.2.2.7  Input Capacitor
        8. 8.2.2.8  UVLO Divider
        9. 8.2.2.9  Soft-Start Capacitor
        10. 8.2.2.10 MOSFETs QH1 and QL1
        11. 8.2.2.11 MOSFETs QH2 and QL2
        12. 8.2.2.12 Frequency Compensation
        13. 8.2.2.13 External Component Selection
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Bi-Directional Power Backup
      2. 8.3.2 Parallel (Multiphase) Operation
  10. Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Stage Layout
      2. 10.1.2 Gate Driver Layout
      3. 10.1.3 Controller Layout
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 サード・パーティ製品に関する免責事項
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design with WEBENCH Tools
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Gate Driver Layout

The LM5177 high-side and low-side gate drivers incorporate short propagation delays, frequency depended dead-time control, and low-impedance output stages capable of delivering large peak currents with very fast rise and fall times to facilitate rapid turn-on and turn-off transitions of the external power MOSFETs. Very high di/dt can cause unacceptable ringing if the trace lengths are not well controlled. Minimization of stray or parasitic gate loop inductance is key to optimizing gate drive switching performance, whether it be series gate inductance that resonates with MOSFET gate capacitance or common source inductance (common to gate and power loops) that provides a negative feedback component opposing the gate drive command, and thereby increasing MOSFET switching times.

Connections from the gate driver outputs, HO1 and HO2, to the respective gates of the high-side MOSFETs must be as short as possible to reduce series parasitic inductance. Route HO1 and HO2 and SW1 and SW2 gate traces as a differential pair from the device pin to the high-side MOSFET, taking advantage of flux cancellation by reducing the loop area.

Connections from gate driver outputs, LO1 and LO2, to the respective gates of the low-side MOSFETs must be as short as possible to reduce series parasitic inductance. Route LO1 and LO2, and PGND traces as a differential pair from the device pin to the low-side MOSFET, taking advantage of flux cancellation by reducing the loop area.

Minimize the current loop path from the VCC, HB1, and HB2 pins through their respective capacitors as these provide the high instantaneous current.