JAJSN45F May 1999 – January 2022 LM567C
PRODUCTION DATA
Fabrication Attributes | General Die Information | ||
---|---|---|---|
Physical Die Identification | LM567C | Bond Pad Opening Size (min) | 91µm x 91µm |
Die Step | C | Bond Pad Metalization | 0.5% COPPER_BAL. ALUMINUM |
Physical Attributes | Passivation | VOM NITRIDE | |
Wafer Diameter | 150mm | Back Side Metal | BARE BACK |
Dise Size (Drawn) | 1600µm x 1626µm 63.0mils x 64.0mils | Back Side Connection | Floating |
Thickness | 406µm Nominal | ||
Min Pitch | 198µm Nominal | ||
Special Assembly Requirements: | |||
Note: Actual die size is rounded to the nearest micron. |
Die Bond Pad Coordinate Locations (C - Step) | ||||||
---|---|---|---|---|---|---|
(Referenced to die center, coordinates in µm) NC = No Connection, N.U. = Not Used | ||||||
SIGNAL NAME | PAD# NUMBER | X/Y COORDINATES | PAD SIZE | |||
X | Y | X | Y | |||
OUTPUT FILTER | 1 | -673 | 686 | 91 | x | 91 |
LOOP FILTER | 2 | -673 | -419 | 91 | x | 91 |
INPUT | 3 | -673 | -686 | 91 | x | 91 |
V+ | 4 | -356 | -686 | 91 | x | 91 |
TIMING RES | 5 | 673 | -122 | 91 | x | 91 |
TIMING CAP | 6 | 673 | 76 | 91 | x | 91 |
GND | 7 | 178 | 686 | 117 | x | 91 |
OUTPUT | 8 | -318 | 679 | 117 | x | 104 |