JAJSDW3 データシート

JAJSDW3 August 2017 LM60-Q1

PRODUCTION DATA.

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）

DBZ|3
- MPDS108G

サーマルパッド・メカニカル・データ

発注情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Supply voltage	−0.2	12	V
Output voltage	−0.6	V_S+ 0.6	V
Output current		10	mA
Input current at any pin⁽²⁾		5	mA
Maximum junction temperature (T_JMAX)		125	°C
Storage temperature (T_stg)	−65	150	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) When the input voltage (V_I) at any pin exceeds power supplies (V_I < GND or V_I > +V_S), the current at that pin should be limited to 5 mA.

7.2 ESD Ratings

			VALUE	UNIT
V_(ESD)	Electrostatic discharge⁽²⁾	Human-body model (HBM), per AEC Q100-002⁽¹⁾	±2500	V
V_(ESD)	Electrostatic discharge⁽²⁾	Machine model (MM)	±250	V

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

(2) The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

		MIN	MAX	UNIT
LM60-Q1 (T_MIN ≤ T_A ≤ T_MAX)		–40	125	°C
Supply voltage (+V_S)		2.7	10	V

(1) Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages.

7.4 Thermal Information

THERMAL METRIC⁽¹⁾		LM60-Q1	UNIT
		DBZ (SOT-23)
		3 PINS
R_θJA⁽²⁾	Junction-to-ambient thermal resistance	266	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	135	°C/W
R_θJB	Junction-to-board thermal resistance	59	°C/W
ψ_JT	Junction-to-top characterization parameter	18	°C/W
ψ_JB	Junction-to-board characterization parameter	58	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor or IC Package Thermal Metrics application report.

(2) The junction to ambient thermal resistance (R_θJA) is specified without a heat sink in still air.

7.5 Electrical Characteristics

Unless otherwise noted, these specifications apply for +V_S = 3 V_DC and I_LOAD = 1 μA. All limits T_A = T_J = 25°C unless otherwise noted.

PARAMETER	TEST CONDITIONS		MIN⁽²⁾	TYP⁽¹⁾	MAX⁽²⁾	UNIT
Accuracy⁽³⁾	LM60-Q1		–3		3	°C
Accuracy⁽³⁾	LM60-Q1	T_A = T_J= T_MIN to T_MAX	–4		4	°C
Output voltage at 0°C				424		mV
Nonlinearity⁽⁴⁾	LM60-Q1	T_A = T_J= T_MIN to T_MAX	–0.8		±0.8	°C
Sensor gain (average slope)	LM60-Q1	T_A = T_J= T_MIN to T_MAX	6		6.5	mV/°C
Output impedance	T_A = T_J= T_MIN to T_MAX				800	Ω
Line regulation⁽⁵⁾	3 V ≤ +V_S ≤ 10 V	T_A = T_J= T_MIN to T_MAX	–0.3		0.3	mV/V
Line regulation⁽⁵⁾	2.7 V ≤ +V_S ≤ 3.3 V	T_A = T_J= T_MIN to T_MAX	–2.3		2.3	mV
Quiescent current	2.7 V ≤ +V_S ≤ 10 V			82	110	μA
Quiescent current	2.7 V ≤ +V_S ≤ 10 V	T_A = T_J= T_MIN to T_MAX			125	μA
Change of quiescent current	2.7 V ≤ +V_S ≤ 10 V			±5		μA
Temperature coefficient of quiescent current				0.2		μA/°C
Long-term stability⁽⁶⁾	T_J = T_MAX = 125°C for 1000 hours			±0.2		°C

(1) Typicals are at T_J = T_A= 25°C and represent most likely parametric norm.

(2) Limits are specified to TI's AOQL (Average Outgoing Quality Level).

(3) Accuracy is defined as the error between the output voltage and 6.25 mV/°C times the case temperature of the device plus 424 mV, at specified conditions of voltage, current, and temperature (expressed in °C).

(4) Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the rated temperature range of the device.

(5) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance.

(6) For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, temperature cycled for at least 46 hours before long-term life test begins for both temperatures. This is especially true when a small (surface-mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate.