SNOS792E May   1999  – December 2024 LM6172

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics ±15V
    6. 5.6 Electrical Characteristics ±5V
    7. 5.7 Typical Characteristics: D (SOIC, 8) Package
    8. 5.8 Typical Characteristics: P (PDIP, 8) Package
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Slew Rate
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Circuit Operation
      2. 7.1.2 Reduce Settling Time
      3. 7.1.3 Drive Capacitive Loads
      4. 7.1.4 Compensation for Input Capacitance
      5. 7.1.5 Termination
    2. 7.2 Typical Application
      1. 7.2.1 Application Circuits
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Power Supply Bypassing
      2. 7.3.2 Power Dissipation
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Printed Circuit Boards and High-Speed Op Amps
        2. 7.4.1.2 Using Probes
        3. 7.4.1.3 Components Selection and Feedback Resistor
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • D|8
  • P|8
サーマルパッド・メカニカル・データ

7.4.1.1 Printed Circuit Boards and High-Speed Op Amps

There are many things to consider when designing printed circuit boards (PCBs) for high-speed op amps. Without proper caution, excessive ringing, oscillation and other degraded ac performance in high-speed circuits can occur. As a rule, use short and wide the signal traces to provide low inductance and low impedance paths. Ground any unused board space to reduce stray signal pickup. Also ground critical components at a common point to eliminate voltage drop. Sockets add capacitance to the board and can affect frequency performance. Best practice is to solder the amplifier directly into the PCB without using a socket.