JAJSRB9 September 2023 LM74700D-Q1
PRODUCTION DATA
THERMAL METRIC(1) | LM74700D-Q1 | UNIT | |
---|---|---|---|
D (SOIC) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 128.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 70.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 71.6 | °C/W |
ΨJT | Junction-to-top characterization parameter | 22.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 70.8 | °C/W |