JAJSE81B
December 2017 – October 2019
LM76002-Q1
,
LM76003-Q1
PRODUCTION DATA.
1
特長
2
アプリケーション
3
概要
概略回路図
効率と出力電流との関係 (VOUT=5V、fSW=400kHz、自動モード)
4
改訂履歴
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Characteristics
6.7
Switching Characteristics
6.8
System Characteristics
6.9
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Fixed-Frequency, Peak-Current-Mode Control
7.3.2
Light Load Operation Modes — PFM and FPWM
7.3.3
Adjustable Output Voltage
7.3.4
Enable (EN Pin) and UVLO
7.3.5
Internal LDO, VCC UVLO, and Bias Input
7.3.6
Soft Start and Voltage Tracking (SS/TRK)
7.3.7
Adjustable Switching Frequency (RT) and Frequency Synchronization
7.3.8
Minimum On-Time, Minimum Off-Time, and Frequency Foldback at Dropout Conditions
7.3.9
Internal Compensation and CFF
7.3.10
Bootstrap Voltage and VBOOT UVLO (BOOT Pin)
7.3.11
Power Good and Overvoltage Protection (PGOOD)
7.3.12
Overcurrent and Short-Circuit Protection
7.3.13
Thermal Shutdown
7.4
Device Functional Modes
7.4.1
Shutdown Mode
7.4.2
Standby Mode
7.4.3
Active Mode
7.4.4
CCM Mode
7.4.5
DCM Mode
7.4.6
Light Load Mode
7.4.7
Foldback Mode
7.4.8
Forced Pulse-Width-Modulation Mode
7.4.9
Self-Bias Mode
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Custom Design With WEBENCH® Tools
8.2.2.2
Output Voltage Setpoint
8.2.2.3
Switching Frequency
8.2.2.4
Input Capacitors
8.2.2.5
Inductor Selection
8.2.2.6
Output Capacitor Selection
8.2.2.7
Feed-Forward Capacitor
8.2.2.8
Bootstrap Capacitors
8.2.2.9
VCC Capacitors
8.2.2.10
BIAS Capacitors
8.2.2.11
Soft-Start Capacitors
8.2.2.12
Undervoltage Lockout Setpoint
8.2.2.13
PGOOD
8.2.2.14
Synchronization
8.2.3
Application Curves
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.1.1
Layout Highlights
10.1.2
Compact Layout for EMI Reduction
10.1.3
Ground Plane and Thermal Considerations
10.1.4
Feedback Resistors
10.2
Layout Example
10.3
Thermal Design
11
デバイスおよびドキュメントのサポート
11.1
デバイス・サポート
11.1.1
開発サポート
11.1.1.1
WEBENCH®ツールによるカスタム設計
11.2
ドキュメントの更新通知を受け取る方法
11.3
サポート・リソース
11.4
商標
11.5
静電気放電に関する注意事項
11.6
Glossary
12
メカニカル、パッケージ、および注文情報
パッケージ・オプション
メカニカル・データ(パッケージ|ピン)
RNP|30
MPQF448C
サーマルパッド・メカニカル・データ
RNP|30
QFND666
発注情報
jajse81b_oa
jajse81b_pm
8.2.2
Detailed Design Procedure