SBOSAM6 January   2000  – December 2024 LMC6035-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Capacitive Load Tolerance
    2. 7.2 Typical Applications
      1. 7.2.1 Differential Driver
      2. 7.2.2 Low-Pass Active Filter
        1. 7.2.2.1 Low-Pass Frequency Scaling Procedure
      3. 7.2.3 High-Pass Active Filter
        1. 7.2.3.1 High-Pass Frequency Scaling Procedure
      4. 7.2.4 Dual-Amplifier Bandpass Filter
        1. 7.2.4.1 DABP Component Selection Procedure
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Printed Circuit Board (PCB) Layout for High-Impedance Work
      2. 7.3.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3.     Trademarks
    4. 8.3 Electrostatic Discharge Caution
    5. 8.4 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

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発注情報

9 Revision History

Changes from Revision SNOS875G (April 2013) to Revision * (December 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added the Pin Configuration and Functions, Specifications, ESD Ratings, Recommended Operating Conditions, Thermal Information, Detailed Description, Overview, Functional Block Diagram, Application and Implementation, Application Information, Typical Applications, Power Supply Recommendations, Layout, Layout Guidelines, Layout Example, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Moved LMC6035-Q1 from SBOS875G to SBOSAM6Go
  • Updated Features Go
  • Updated Description Go
  • Deleted Figure 1, 8-Bump DSBGA Package Go
  • Added difference amplifier application with RES11 imageGo
  • Updated figures and tables in Pin Configuration and Functions Go
  • Updated parameter names and symbolsGo
  • Moved previous table note 4 into open-loop gain test conditionsGo
  • Updated previous table note 2 from AC Electrical Characteristics and moved conditions to slew rate test conditionsGo
  • Moved previous table note 3 from AC Electrical Characteristics to crosstalk test conditionsGo
  • Changed AVOL to AOL Go
  • Updated Figure 7-7Go
  • Updated Figure 7-8Go
  • Updated Figure 7-9Go
  • Added reference to Measurement and Calibration Techniques for Ultra-low Current Measurement Systems application note in Printed Circuit Board (PCB) Layout for High-Impedance Work Go