SBOSAM6 January   2000  – December 2024 LMC6035-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Capacitive Load Tolerance
    2. 7.2 Typical Applications
      1. 7.2.1 Differential Driver
      2. 7.2.2 Low-Pass Active Filter
        1. 7.2.2.1 Low-Pass Frequency Scaling Procedure
      3. 7.2.3 High-Pass Active Filter
        1. 7.2.3.1 High-Pass Frequency Scaling Procedure
      4. 7.2.4 Dual-Amplifier Bandpass Filter
        1. 7.2.4.1 DABP Component Selection Procedure
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
        1. 7.3.1.1 Printed Circuit Board (PCB) Layout for High-Impedance Work
      2. 7.3.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3.     Trademarks
    4. 8.3 Electrostatic Discharge Caution
    5. 8.4 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

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メカニカル・データ(パッケージ|ピン)
  • D|8
サーマルパッド・メカニカル・データ
発注情報

High-Pass Frequency Scaling Procedure

Choose a standard capacitor value and scale the impedances in the circuit according to the desired cutoff frequency (300Hz) as follows:

Equation 8. C=C1=C2
Equation 9. Z= 12πfcC=12π×300Hz×6.8nF=78.05kΩ
Equation 10. R1= Z×R1normalized=78.05kΩ×10.707=110.4kΩ

A standard value of 110kΩ is chosen for R1.

Equation 11. R2= Z×R2normalized=78.05kΩ×11.414=55.2kΩ

A standard value of 54.9kΩ is chosen for R2.