JAJSIG5C May   2019  – December 2024 LMG1025-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stage
      2. 6.3.2 Output Stage
      3. 6.3.3 Bias Supply and Under Voltage Lockout
      4. 6.3.4 Overtemperature Protection (OTP)
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Handling Ground Bounce
        2. 7.2.2.2 Creating Nanosecond Pulse
        3. 7.2.2.3 VDD and Overshoot
        4. 7.2.2.4 Operating at Higher Frequency
      3. 7.2.3 Application Curves
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Gate Drive Loop Inductance and Ground Connection
      2. 9.1.2 Bypass Capacitor
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 サード・パーティ製品に関する免責事項
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 Trademarks
    6. 10.6 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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メカニカル・データ(パッケージ|ピン)
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サーマルパッド・メカニカル・データ

Output Stage

LMG1025-Q1 provides 7-A source, 5-A sink (asymmetrical drive) peak-drive current capability, and features a split output configuration. The OUTH and OUTL outputs of the LMG1025-Q1 allow the user to use independent resistors connecting to the gate. The two resistors allow the user to independently adjust the turn-on and turn-off drive strengths to control slew rate and EMI, and to control ringing on the gate signal. For GaN FETs, controlling ringing is important to reduce stress on the GaN FET and driver. The output stage OUTL is also pulled down in undervoltage condition, which prevents the unintended charge accumulation of device Ciss, and thus preventing false turn-on. This ringing heavily depends on the layout as switching frequency increases and as rise and fall time gets shorter. The distance between the gate driver and power device need to be as minimum as possible. Gate loop should be as minimum as possible. If ringing is un-avoidable then the gate resistor should be selected in such a way that the ringing is minimized. Bypass capacitor type, value, and position also significantly affects this ringing.