JAJSRX4 May 2024 LMG2650
ADVANCE INFORMATION
The turn-on slew rate of both the low-side and high-side GaN power FETs are individually programmed to one of four discrete settings. The low-side slew rate is programmed by the resistance between the RDRVL and AGND pins. The high-side slew rate is programmed by the resistance between the RDRVH and SW pins. The low-side slew-rate setting is determined one time during AUX power up when the AUX voltage goes above the AUX power-on reset voltage. The high-side slew-rate setting is determined one time during BST-to-SW power up when the BST-to-SW voltage goes above the BST power-on reset voltage. The slew-rate setting determination time is not specified but is around 0.4µs.
Table 7-1 shows the recommended typical resistance programming value for the four slew rate settings and the typical turn-on slew rate at each setting. As noted in the table, an open-circuit connection is acceptable for programming slew-rate setting 0 and a short-circuit connection (RDRVL shorted to AGND for the low-side turn-on slew rate) (RDRVH shorted to SW for the high-side turn-on slew rate) is acceptable for programming slew-rate setting 3.
TURN-ON SLEW RATE SETTING | RECOMMENDED
TYPICAL PROGRAMMING RESISTANCE (kΩ) |
TYPICAL
TURN-ON SLEW RATE (V/ns) |
COMMENT |
---|---|---|---|
0 | 120 | 2 | Open-circuit connection for programming resistance is acceptable. |
1 | 47 | 9 | |
2 | 22 | 50 | |
3 | 5.6 | 80 | Short-circuit connection for programming resistance (RDRVL shorted to AGND for low-side slew rate) (RDRVH shorted to SW for high-side slew rate) is acceptable. |