JAJSSU3 January   2024 LMG3100R017

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
  7. Typical Characteristics
  8. Parameter Measurement Information
    1. 7.1 Propagation Delay and Mismatch Measurement
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Control Inputs
      2. 8.3.2 Start-up and UVLO
      3. 8.3.3 Bootstrap Supply Voltage Clamping
      4. 8.3.4 Level Shift
    4. 8.4 Device Functional Modes
  10.   Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VCC Bypass Capacitor
        2. 9.2.2.2 Bootstrap Capacitor
        3. 9.2.2.3 Slew Rate Control
        4. 9.2.2.4 Use With Analog Controllers
        5. 9.2.2.5 Power Dissipation
    3.     Power Supply Recommendations
    4. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Examples
  11. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  12. 10Revision History
  13. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Information
    2. 11.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
  • VBE|15
サーマルパッド・メカニカル・データ
発注情報

Layout Examples

Placements shown in Figure 9-4 and in the cross section of Figure 9-5 show the suggested placement of the device with respect to sensitive passive components, such as VIN, bootstrap capacitors (HS and HB) and VSS capacitors. Use appropriate spacing in the layout to reduce creepage and maintain clearance requirements in accordance with the application pollution level. Inner layers if present can be more closely spaced due to negligible pollution.

The layout must be designed to minimize the capacitance at the SW node. Use as small an area of copper as possible to connect the device SW pin to the inductor, or transformer, or other output load. Furthermore, ensure that the ground plane or any other copper plane has a cutout so that there is no overlap with the SW node, as this would effectively form a capacitor on the printed circuit board. Additional capacitance on this node reduces the advantages of the advanced packaging approach of the LMG3100 and may result in reduced performance.

GUID-D58D51B6-5BCB-4BF9-B3CA-80C8845EEFF6-low.svgFigure 9-4 External Component Placement (Multi Layer Board)
GUID-D3ED8E8E-5586-48CA-A21A-4BAD2F34DA78-low.svgFigure 9-5 Four-Layer Board Cross Section With Return Path Directly Underneath for Power Loop