JAJSFL4B April   2016  – June 2018 LMH0324

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      ブロック概略図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Configuration Pins
      2. 7.3.2 Carrier Detect
      3. 7.3.3 Adaptive Cable Equalizer
      4. 7.3.4 Launch Amplitude
      5. 7.3.5 Input-Output Mux Selection
      6. 7.3.6 Output Function Control
      7. 7.3.7 Output Driver Amplitude and De-Emphasis Control
      8. 7.3.8 Additional Programmability
        1. 7.3.8.1 Cable Length Indicator (CLI)
        2. 7.3.8.2 Digital MUTEREF
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transactions
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
          1. 7.4.2.1.1 SPI Write Transaction Format
          2. 7.4.2.1.2 SPI Read Transaction Format
        2. 7.4.2.2 SPI Daisy Chain
    5. 7.5 LMH0324 Register Map
      1. 7.5.1 Share Register Page
      2. 7.5.2 CableEQ/Drivers Register Page
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for SMPTE Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Recommended VOD and DE Register Settings
      4. 8.2.4 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 コミュニティ・リソース
    3. 11.3 商標
    4. 11.4 静電気放電に関する注意事項
    5. 11.5 Glossary
  12. 12メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
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サーマルパッド・メカニカル・データ
発注情報

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.