JAJSI47B April   2017  – October 2019 LMH0397

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     ブロック概略図
  4. 改訂履歴
  5. 概要(続き)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Recommended SMBus Interface Timing Specifications
    7. 7.7 Serial Parallel Interface (SPI) Timing Specifications
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Equalizer Mode (EQ Mode)
      2. 8.1.2 Cable Driver Mode (CD Mode)
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  4-Level Input Pins and Thresholds
      2. 8.3.2  Equalizer (EQ) and Cable Driver (CD) Mode Control
        1. 8.3.2.1 EQ/CD_SEL Control
        2. 8.3.2.2 OUT0_SEL and SDI_OUT_SEL Control
      3. 8.3.3  Input Carrier Detect
      4. 8.3.4  –6-dB Splitter Mode Launch Amplitude for SDI_IO+ (EQ Mode Only)
      5. 8.3.5  Continuous Time Linear Equalizer (CTLE)
        1. 8.3.5.1 Line-Side Adaptive Cable Equalizer (SDI_IO+ in EQ Mode)
        2. 8.3.5.2 Host-Side Adaptive PCB Trace Equalizer (IN0± in CD Mode)
      6. 8.3.6  Clock and Data (CDR) Recovery
      7. 8.3.7  Internal Eye Opening Monitor (EOM)
      8. 8.3.8  Output Function Control
      9. 8.3.9  Output Driver Control
        1. 8.3.9.1 Line-Side Output Cable Driver (SDI_IO+ in CD Mode, SDI_OUT+ in EQ or CD Mode)
          1. 8.3.9.1.1 Output Amplitude (VOD)
          2. 8.3.9.1.2 Output Pre-Emphasis
          3. 8.3.9.1.3 Output Slew Rate
          4. 8.3.9.1.4 Output Polarity Inversion
        2. 8.3.9.2 Host-Side 100-Ω Output Driver (OUT0± in EQ or CD Mode)
      10. 8.3.10 Status Indicators and Interrupts
        1. 8.3.10.1 LOCK_N (Lock Indicator)
        2. 8.3.10.2 CD_N (Carrier Detect)
        3. 8.3.10.3 INT_N (Interrupt)
      11. 8.3.11 Additional Programmability
        1. 8.3.11.1 Cable EQ Index (CEI)
        2. 8.3.11.2 Digital MUTEREF
    4. 8.4 Device Functional Modes
      1. 8.4.1 System Management Bus (SMBus) Mode
        1. 8.4.1.1 SMBus Read and Write Transaction
          1. 8.4.1.1.1 SMBus Write Operation Format
          2. 8.4.1.1.2 SMBus Read Operation Format
      2. 8.4.2 Serial Peripheral Interface (SPI) Mode
        1. 8.4.2.1 SPI Read and Write Transactions
        2. 8.4.2.2 SPI Write Transaction Format
        3. 8.4.2.3 SPI Read Transaction Format
        4. 8.4.2.4 SPI Daisy Chain
    5. 8.5 Register Maps
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 SMPTE Requirements and Specifications
      2. 9.1.2 Low-Power Optimization in CD Mode
    2. 9.2 Typical Applications
      1. 9.2.1 Bidirectional I/O
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Cable Equalizer With Loop-Through
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Stack-Up and Ground References
      2. 11.1.2 High-Speed PCB Trace Routing and Coupling
        1. 11.1.2.1 SDI_IO± and SDI_OUT±
        2. 11.1.2.2 IN0± and OUT0±
      3. 11.1.3 Anti-Pads
      4. 11.1.4 BNC Connector Layout and Routing
      5. 11.1.5 Power Supply and Ground Connections
      6. 11.1.6 Footprint Recommendations
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 デバイス・サポート
      1. 12.1.1 開発サポート
    2. 12.2 ドキュメントのサポート
      1. 12.2.1 関連資料
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 サポート・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 輸出管理に関する注意事項
    8. 12.8 Glossary
  13. 13メカニカル、パッケージ、および注文情報
    1. 13.1 Package Option Addendum
      1. 13.1.1 Packaging Information
      2. 13.1.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Application Curves

Depending on operation in EQ or CD Mode, the LMH0397 performance was measured with the test setups shown in Figure 22 and Figure 23.

LMH0397 app_test_setup_diagram_EQMode.gifFigure 22. Test Setup for LMH0397 in EQ Mode
LMH0397 app_test_setup_diagram_CDMode.gifFigure 23. Test Setup for LMH0397 in CD Mode

The eye diagrams in this subsection show how the LMH0397 improves overall signal integrity in the data path for 75-Ω coax at SDI_IO+ when operating in EQ Mode and 100-Ω differential FR4 PCB trace at IN0± when operating in CD Mode.

LMH0397 EQ_2.97G_200m_Reclocked_PRBS10_114mV_56ps.png
EQ Mode, measured at OUT0±
HOST_EQ0 = F, SDI_OUT_SEL = H, OUT_CTRL = F
Figure 24. 2.97 Gbps, CC = 200-m Belden 1694A, Reclocked
LMH0397 EQ_1.485G_300m_Reclocked_PRBS10_114mV_112ps.png
EQ Mode, measured at OUT0±
HOST_EQ0 = F, SDI_OUT_SEL = H, OUT_CTRL = F
Figure 26. 1.485 Gbps, CC = 300-m Belden 1694A, Reclocked
LMH0397 EQ_270M_600m_Reclocked_PRBS10_114mV_617ps.png
EQ Mode, measured at OUT0±
HOST_EQ0 = F, SDI_OUT_SEL = H, OUT_CTRL = F
Figure 28. 270 Mbps, CC = 600-m Belden 1694A, Reclocked
LMH0397 CD_IO_2.97G_PRBS10_200mV_56ps.png
CD Mode, measured at SDI_IO+
HOST_EQ0 = F, SDI_OUT_SEL = H, OUT_CTRL = F
Figure 25. 2.97 Gbps, TL = 20" FR4, Reclocked
LMH0397 CD_IO_1.485G_PRBS10_200mV_112ps.png
CD Mode, measured at SDI_IO+
HOST_EQ0 = F, SDI_OUT_SEL = H, OUT_CTRL = F
Figure 27. 1.485 Gbps, TL = 20" FR4, Reclocked
LMH0397 CD_IO_270M_PRBS10_200mV_617ps.png
CD Mode, measured at SDI_IO+
HOST_EQ0 = F, SDI_OUT_SEL = H, OUT_CTRL = F
Figure 29. 270 Mbps, TL = 20" FR4, Reclocked