JAJSI48C March   2017  – October 2019 LMH1228

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     ブロック概略図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 4-Level Input Pins and Thresholds
      2. 7.3.2 OUT0_SEL and SDI_OUT2_SEL Control
      3. 7.3.3 Input Signal Detect
      4. 7.3.4 Continuous Time Linear Equalizer (CTLE)
      5. 7.3.5 Clock and Data (CDR) Recovery
      6. 7.3.6 Internal Eye Opening Monitor (EOM)
      7. 7.3.7 Output Function Control
      8. 7.3.8 Output Driver Control
        1. 7.3.8.1 Line-Side Output Cable Driver (SDI_OUT1+, SDI_OUT2+)
          1. 7.3.8.1.1 Output Amplitude (VOD)
          2. 7.3.8.1.2 Output Pre-Emphasis
          3. 7.3.8.1.3 Output Slew Rate
          4. 7.3.8.1.4 Output Polarity Inversion
        2. 7.3.8.2 Host-Side 100-Ω Output Driver (OUT0±)
      9. 7.3.9 Status Indicators and Interrupts
        1. 7.3.9.1 LOCK_N (Lock Indicator)
        2. 7.3.9.2 SD_N (Signal Detect)
        3. 7.3.9.3 INT_N (Interrupt)
    4. 7.4 Device Functional Modes
      1. 7.4.1 System Management Bus (SMBus) Mode
        1. 7.4.1.1 SMBus Read and Write Transaction
          1. 7.4.1.1.1 SMBus Write Operation Format
          2. 7.4.1.1.2 SMBus Read Operation Format
      2. 7.4.2 Serial Peripheral Interface (SPI) Mode
        1. 7.4.2.1 SPI Read and Write Transactions
        2. 7.4.2.2 SPI Write Transaction Format
        3. 7.4.2.3 SPI Read Transaction Format
        4. 7.4.2.4 SPI Daisy Chain
    5. 7.5 Register Maps
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 SMPTE Requirements and Specifications
      2. 8.1.2 Low-Power Optimization
      3. 8.1.3 Optimized Loop Bandwidth Settings for Arria 10 FPGA Applications
    2. 8.2 Typical Applications
      1. 8.2.1 Dual Cable Driver
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Distribution Amplifier
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Stack-Up and Ground References
      2. 10.1.2 High-Speed PCB Trace Routing and Coupling
        1. 10.1.2.1 SDI_OUT1± and SDI_OUT2±:
        2. 10.1.2.2 IN0± and OUT0±:
      3. 10.1.3 Anti-Pads
      4. 10.1.4 BNC Connector Layout and Routing
      5. 10.1.5 Power Supply and Ground Connections
      6. 10.1.6 Footprint Recommendations
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 輸出管理に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

10.1.2 High-Speed PCB Trace Routing and Coupling

Observe the following general high-speed recommendations for high-speed trace routing:

  • For differential pairs, maintain a uniform width and gap for each differential pair where possible. When traces must diverge (for example, due to AC-coupling capacitors), ensure that the traces branch out or merge uniformly.
  • To prevent reflections due to trace routing, ensure that trace bends are at most 45°. Right angle bends should be implemented with at least two 45° corners. Radial bends are ideal.
  • Avoid using signal vias. If signal vias must be used, a return path (GND) via must be placed near the signal via to provide a consistent ground reference and minimize impedance discontinuities.
  • Avoid via stubs by back-drilling as necessary.