JAJSI19D October   2019  – January 2023 LMH32401

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Gain = 2 kΩ
    6. 6.6 Electrical Characteristics: Gain = 20 kΩ
    7. 6.7 Electrical Characteristics: Both Gains
    8. 6.8 Electrical Characteristics: Logic Threshold and Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switched Gain Transimpedance Amplifier
      2. 7.3.2 Clamping and Input Protection
      3. 7.3.3 ESD Protection
      4. 7.3.4 Differential Output Stage
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ambient Light Cancellation (ALC) Mode
      2. 7.4.2 Power-Down Mode (Multiplexer Mode)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RGT|16
  • Y|0
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configuration and Functions

GUID-5D1E49E7-716A-4F68-A969-D15E981B35FE-low.gif Figure 5-1 RGT Package, 16-Pin VQFN with Exposed Thermal Pad (Top View)
Table 5-1 Pin Functions
PIN TYPE(2) DESCRIPTION
NAME NO.
EN 6 I Device enable pin. EN = logic low = normal operation (default)(1); EN = logic high = power off mode.
GAIN 16 I Gain setting. GAIN = low = 2 kΩ (default)(1); GAIN = high = 20 kΩ.
GND 1, 7 I Amplifier ground.
IDC_EN 5 I Ambient light cancellation (ALC) loop enable. IDC_EN = logic low = enable DC current cancellation (default)(1); IDC_EN = logc high = disable DC current cancellation.
IN 3 I Transimpedance amplifier input.
NC 4, 8, 13, 15 — No connection.
OUT– 11 O Inverting amplifier output. When light is incident on the photodiode the output pin transitions in a negative direction from the no light condition (APD anode connected to negative bias).
OUT+ 10 O Noninverting amplifier output. When light is incident on the photodiode the output pin transitions in a positive direction from the no light condition (APD anode connected to negative bias).
VDD1 2 I Positive power supply for the transimpedance amplifier stage.
VDD2 14 I Positive power supply for the differential amplifier stage. Tie VDD1 and VDD2 to the same power supply with independent power-supply bypassing.
VOCM 12 I Differential amplifier common-mode output setting.
VOD 9 I Differential amplifier differential output offset setting.
Thermal pad — Connect the thermal pad to GND or the most negative power supply of the device under test (DUT).
(1) TI recommends driving a digital pin with a low-impedance source rather than leaving the pin floating because fast-moving transients can couple into the pin and inadvertently change the logic level.
(2) I = input, O = output
DIE THICKNESS BACKSIDE FINISH BACKSIDE POTENTIAL BOND PAD METALLIZATION
381 μm Silicon with backgrind Wafer backside is not electrically isolated and should be held at the same potential as the most negative power supply connected to the die (GND) AlCu
Figure 5-2 Bare Die Package
Table 5-2 Bond Pad Coordinates of Bare Die Version in Microns
PAD NUMBER PAD NAME X-MIN Y-MIN X-MAX Y-MAX
1 GND 15 711.4 90 786.4
2 VDD1 15 543 90 618
3 IN 15 362 90 437
4 NC 15 201 90 276
5 IDC_EN 124.675 15 199.675 90
6 EN 286.675 15 361.675 90
7 GND 547.7 15 622.7 90
8 NC 713.675 15 788.675 90
9 VOD 855 169.075 930 244.075
10 OUT+ 855 307.6 930 382.6
11 NC 855 452.5 930 527.5
12 OUT- 855 597.325 930 672.325
13 VOCM 855 736.05 930 811.05
14 NC 713.65 890 788.65 965
15 VDD2 547.675 890 622.675 965
16 NC 286.675 890 361.675 965
17 GAIN 124.675 890 199.675 965