7.1 Absolute Maximum Ratings(1)(2)
over operating free-air temperature range (unless otherwise noted) | MIN | MAX | UNIT |
VIN differential |
| ±2.5 |
V |
Output short circuit duration |
See (4) and (6) |
|
Supply voltage (V+ – V–) |
| 13.5 |
V |
Voltage at input/output pins |
| V+ +0.8 V– –0.8 |
V |
Input current |
| ±10 |
mA |
Junction temperature(5) |
| +150 |
°C |
Soldering information |
Infrared or convection reflow (20 s) |
| 235 |
°C |
Wave soldering lead temperature (10 s) |
| 260 |
°C |
Storage temperature range, Tstg |
–65 |
+150 |
°C |
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Human body model, 1.5 kΩ in series with 100 pF. Machine Model, 0 Ω in series with 200 pF.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PC board.